Abstract: There is described a blind for installation between an inner environment and an outer environment where light originates. The blind comprises slats substantially forming a vertically periodic arrangement. Each one of the slats extends in a substantially horizontal axis, and comprises an upper surface and a lower surface. The upper surface has a normal oriented both upwardly and toward the outer environment, and comprises a coating providing specular reflection. The lower surface has reflection normal oriented both downwardly and toward any one of the outer environment and the inner environment, and comprises a coating providing specular reflection. The upper surface and the lower surface of a given slat are joined at an apex pointing toward the outer environment.

Abstract: There is described an apparatus for converting heat dissipated from a pipe of a refrigeration cycle into electric power. The pipe has an outer surface from which heat dissipates. The apparatus comprises at least one TEG receptacle for installing a thermoelectric generator therein, the TEG receptacle comprising a cold side and a hot side. The apparatus further comprises at least one conductive body in thermal contact with at least a portion of the outer surface of the pipe and adapted to conduct the heat from the outer surface of the pipe to the hot side of at least one TEG receptacle. The apparatus further comprises one heat sink for each one of the at least one TEG receptacle, in thermal contact with the cold side thereof.

Abstract: The present document describes an apparatus for recovering heat from an electronic component to generate electric energy. The apparatus comprises a thermoelectric generator having a cold side and a hot side, the hot side being in thermal communication with the electronic component. The apparatus further comprises a heat dissipation device in thermal communication with the cold side of the thermoelectric generator for dissipate heat it receives, and a heat transfer device for directly transferring the heat from the electronic component to the heat dissipation device.