Patents by Inventor Elis A. Guditz

Elis A. Guditz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for metallizing aluminum pads of an integrated circuit chip
    Patent number: 4372996
    Abstract: A method including a novel bath is described for the nickeling of the aluminum pads of a chip, when either in die form or in wafer assembly. A near-neutral pH immersion zinc bath is used to cover the aluminum with zinc, which is followed by immersion in an electroless boron-nickel solution for nickeling of the zinc. The method eliminates the need to isolate the chip silicon from the plating bath.
    Type: Grant
    Filed: September 7, 1979
    Date of Patent: February 8, 1983
    Assignee: Massachusetts Institute of Technology
    Inventors: Elis A. Guditz, Robert L. Burke
  • Method for selectively nickeling a layer of polymerized polyester resin
    Patent number: 4150177
    Abstract: A method of selectively nickeling a layer of polymerized polyester resin is described. Patterns of electrically conducting nickel are produced on the resin surface by etching the surface of the resin prior to covering the etched surface with a patterned layer of unetched resin which exposes the etched resin in the regions in which metallization is to occur. A palladium plating solution followed by an immersion boron-nickel bath provide the metalization on the etched regions of the resin.
    Type: Grant
    Filed: November 1, 1977
    Date of Patent: April 17, 1979
    Assignee: Massachusetts Institute of Technology
    Inventors: Elis A. Guditz, Robert L. Burke
  • Photoformed plated interconnection of embedded integrated circuit chips
    Patent number: 3965277
    Abstract: A process for electrically interconnecting a group of integrated-circuit chips embedded in plastic is described. Multilayer conductors are plated in grooves photoformed in successively applied plastic layers and connected to the chip pads and to conductors on other layers through vias also photoformed in the plastic. Photoformation of wiring grooves and layer-interconnecting vias is accomplished by ultraviolet irradiation of photosensitized liquid polyester resin.
    Type: Grant
    Filed: February 28, 1974
    Date of Patent: June 22, 1976
    Assignee: Massachusetts Institute of Technology
    Inventors: Elis A. Guditz, Robert L. Burke