Patents by Inventor Elisabeth Cura

Elisabeth Cura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11879078
    Abstract: The present disclosure relates to a curable precursor of a structural adhesive composition, comprising: a) a cationically self-polymerizable monomer; b) a polymerization initiator of the cationically self-polymerizable monomer which is initiated at a temperature T1; c) a curable monomer which is different from the cationically self-polymerizable monomer; and d) a curing initiator of the curable monomer which is initiated at a temperature T2 and which is different from the polymerization initiator of the cationically self-polymerizable monomer. According to another aspect, the present disclosure is directed to a partially cured precursor of a structural adhesive composition. According to still another aspect, the present disclosure relates to a method of bonding to parts. In yet another aspect, the disclosure relates to the use of a curable precursor or a partially cured precursor as described above, for industrial applications, in particular for body-in-white bonding applications for the automotive industry.
    Type: Grant
    Filed: October 3, 2019
    Date of Patent: January 23, 2024
    Assignee: 3M Innovative Properties Company
    Inventors: Adrian T. Jung, Boris Tasch, Dirk Hasenberg, Olaf Ludewig, Elisabeth Cura
  • Publication number: 20230407148
    Abstract: According to one aspect, the present disclosure relates to a curable precursor of a structural adhesive composition, comprising: a) a thermally curable resin; b) a thermal curing initiator for the thermally curable resin; c) a radiation self-polymerizable multi-functional compound comprising a polyether oligomeric backbone and at least one free-radical (co)polymerizable reactive group at each terminal position of the oligomer backbone; and d) a free-radical polymerization initiator for the radiation self-polymerizable multi-functional compound; wherein the free-radical polymerization initiator is activated by visible light.
    Type: Application
    Filed: February 3, 2022
    Publication date: December 21, 2023
    Inventors: Boris Tasch, Adrian Thomas Jung, Elisabeth Cura, Eike H. Klünker, Wolf Steiger, Peter Bissinger
  • Publication number: 20230278646
    Abstract: The present invention relates to a method for producing a body component (1) of a vehicle body (21) of a vehicle (20), wherein the method has the steps of: (a) providing a structural part (2) of the body component (1) provided with adhesive film (4), wherein the adhesive film (4) is applied to at least one adhesive surface (6) of the structural part (2), (b) providing a further part (3) of the body component (1), (c) applying an adhesive (5) to the adhesive film (4), and (d) adhesively bonding the structural part (2) provided with adhesive film (4) to the further part (3) by means of the adhesive (5) applied to the adhesive film (4), so that the body component (1) is obtained as the structural part (2) adhesively bonded to the further part (3) and provided with adhesive film (4). The invention further relates to a body component (1) of a vehicle body (21) of a vehicle (20), as well as to a vehicle body (21) of a vehicle (20) having at least one such body component (1).
    Type: Application
    Filed: July 16, 2021
    Publication date: September 7, 2023
    Inventors: Elisabeth CURA, Nurettin YAVUZ, Robert HERMSDORF
  • Publication number: 20230235204
    Abstract: The present disclosure relates to a curable precursor of a structural adhesive composition, comprising: a thermally curable resin; a thermal curing initiator for the thermally curable resin; a radiation self-polymerizable multi-functional compound comprising a polyether oligomeric backbone and at least one free-radical (co)polymerizable reactive group at each terminal position of the oligomer backbone; and a free-radical polymerization initiator for the radiation self-polymerizable multi-functional compound.
    Type: Application
    Filed: May 21, 2021
    Publication date: July 27, 2023
    Inventors: Adrian T. Jung, Boris Ove Alexander Tasch, Elisabeth Cura, Eike H. Klünker, Peter Bissinger, Wolf Steiger, Dirk Hasenberg
  • Publication number: 20220396716
    Abstract: An expandable structural adhesive film for bonding metal parts. The adhesive film comprises at least one first epoxy compound; at least one epoxy curing agent; at least one blowing agent; at least one film-forming agent; and at least one impact modifier. The structural adhesive film exhibits an elongation at break of at least 300% according to tensile test DIN EN ISO 527 and a free expansion rate according to EN 2667-3 of at least 45%.
    Type: Application
    Filed: September 23, 2020
    Publication date: December 15, 2022
    Inventors: Elisabeth CURA, Bernhard H. KOCH
  • Patent number: 11377576
    Abstract: The present disclosure relates to a thermosettable structural adhesive composition comprising an epoxy compound; a thermoplastic compound; an epoxy curing agent; at least one mineral filler, wherein the at least one mineral filler is capable of absorbing water. The thermosettable structural adhesive composition can exhibit an improved corrosion resistance while also providing good adhesive properties such as good t-peel strength and overlap shear strength.
    Type: Grant
    Filed: November 14, 2016
    Date of Patent: July 5, 2022
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Elisabeth Cura, Sohaib Elgimiabi
  • Publication number: 20220177749
    Abstract: The present disclosure relates to a process of manufacturing curable precursor of a structural adhesive composition. According to another aspect, the present disclosure is directed to method of bonding two parts.
    Type: Application
    Filed: March 26, 2020
    Publication date: June 9, 2022
    Inventors: Elisabeth Cura, Boris Tasch, Adrian Jung
  • Publication number: 20210340406
    Abstract: The present disclosure relates to a curable precursor of a structural adhesive composition, comprising: a) a cationically self-polymerizable monomer; b) a polymerization initiator of the cationically self-polymerizable monomer which is initiated at a temperature T1; c) a curable monomer which is different from the cationically self-polymerizable monomer; and d) a curing initiator of the curable monomer which is initiated at a temperature T2 and which is different from the polymerization initiator of the cationically self-polymerizable monomer. According to another aspect, the present disclosure is directed to a partially cured precursor of a structural adhesive composition. According to still another aspect, the present disclosure relates to a method of bonding to parts. In yet another aspect, the disclosure relates to the use of a curable precursor or a partially cured precursor as described above, for industrial applications, in particular for body-in-white bonding applications for the automotive industry.
    Type: Application
    Filed: October 3, 2019
    Publication date: November 4, 2021
    Inventors: Adrian T. JUNG, Boris TASCH, Dirk HASENBERG, Olaf LUDEWIG, Elisabeth CURA
  • Publication number: 20210222034
    Abstract: An adhesive film liner comprising (a) a polymeric layer having a first and a second surface, the second surface being opposed to the first surface; (b) a first release layer located on top of the first surface of the polymeric layer, the first release layer comprising at least one polyurethane acrylate oligomer and/or at least one polyurethane methacrylate oligomer; and (c) a second release layer located on top of the second surface layer of the polymeric layer, the second release layer comprising at least one acrylate polymer.
    Type: Application
    Filed: June 28, 2019
    Publication date: July 22, 2021
    Inventors: Stefan B. M. Luebbe, Elisabeth Cura, Kanta Kumar, Michael A. Semonick
  • Patent number: 10632707
    Abstract: The invention relates to the use of a structural adhesive film for bonding and sealing a hem flange connection between panels. The structural adhesive film comprises at least one adhesive layer and at least one layer with a porous structure. The adhesive layer comprise an epoxy compound as well as an epoxy curing agent.
    Type: Grant
    Filed: November 14, 2016
    Date of Patent: April 28, 2020
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Elisabeth Cura, Sohaib Elgimiabi, Stefan Luebbe, Kotaro Shinozaki, Saori Ueda
  • Patent number: 10533118
    Abstract: A roll of a double-sided adhesive tape wound around a core, with the tape (10) comprising first (5) and second major adhesive surfaces (4) and at least one adhesive layer comprising a structural adhesive (3) providing the second major adhesive surface (4). The first major adhesive surface (5) is protected by a first liner (1); the second major adhesive surface (4) is protected by a second liner (2), and the second liner (2) extends over the two edges (8, 9) of the second major surface to cover at least part of each first and second minor surfaces (6, 7) of the tape (10).
    Type: Grant
    Filed: June 10, 2014
    Date of Patent: January 14, 2020
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Tomasz P. Wikierak, Pawel M. Malinowski, Marcin J. Paprocki, Elisabeth Cura
  • Publication number: 20190160513
    Abstract: The invention relates to a method of bonding panels together to form a panel assembly, comprising the following steps: providing a first panel (10) with a body portion (11) and an end portion (12) and a second panel (20) with a body portion (21) and an end portion (22); providing a first structural adhesive film (30) and a second structural adhesive film (31); applying the first structural adhesive film (30) on an upper side of the end portion (22) of the second panel (20) and applying the second structural adhesive film (31) on a lower side of the end portion (22) of the second panel (20); bringing the two panels (10 and 20) together and folding the end portion (12) of the first panel (10) around the end portion (22) of the second panel (10) such that the end portion (12) extends essentially parallel to the body portion (11) of the first panel (10) thereby enclosing the end portion (22) of the second panel and such that the first structural adhesive film (30) is positioned between the upper side of the end p
    Type: Application
    Filed: May 11, 2017
    Publication date: May 30, 2019
    Inventors: Bernhard Koch, Elisabeth Cura, Kotaro Shinozaki
  • Publication number: 20180282592
    Abstract: The present disclosure relates to a thermosettable structural adhesive composition comprising an epoxy compound; a thermoplastic compound; an epoxy curing agent; at least one mineral filler, wherein the at least one mineral filler is capable of absorbing water. The thermosettable structural adhesive composition can exhibit an improved corrosion resistance while also providing good adhesive properties such as good t-peel strength and overlap shear strength.
    Type: Application
    Filed: November 14, 2016
    Publication date: October 4, 2018
    Inventors: Elisabeth Cura, Sohaib Elgimiabi
  • Publication number: 20180272646
    Abstract: The invention relates to the use of a structural adhesive film for bonding and sealing a hem flange connection between panels. The structural adhesive film comprises at least one adhesive layer and at least one layer with a porous structure. The adhesive layer comprise an epoxy compound as well as an epoxy curing agent.
    Type: Application
    Filed: November 14, 2016
    Publication date: September 27, 2018
    Inventors: Elisabeth Cura, Sohaib Elgimiabi, Stefan Luebbe, Kotaro Shinozaki, Saori Ueda
  • Publication number: 20180273811
    Abstract: The present disclosure provides a thermosettable structural adhesive composition comprising an epoxy compound; a thermoplastic compound; an epoxy curing agent; non-spherical particles. This composition can be useful for applications, for example, in the form of an adhesive film. Such applications can include bonding of parts (e.g., metal parts), especially those where bonding on an industrial scale is required. The structural adhesive composition may exhibit any one or more of advantageous adhesive strength, a certain resistance to corrosion, as well as a favourable cohesive failure mode.
    Type: Application
    Filed: November 17, 2016
    Publication date: September 27, 2018
    Inventors: Elisabeth Cura, Sohaib Elgimiabi
  • Publication number: 20160108290
    Abstract: A roll of a double-sided adhesive tape wound around a core, with the tape (10) comprising first (5) and second major adhesive surfaces (4) and at least one adhesive layer comprising a structural adhesive (3) providing the second major adhesive surface (4). The first major adhesive surface (5) is protected by a first liner (1); the second major adhesive surface (4) is protected by a second liner (2), and the second liner (2) extends over the two edges (8, 9) of the second major surface to cover at least part of each first (5) and second minor surfaces (6, 7) of the tape (10).
    Type: Application
    Filed: June 10, 2014
    Publication date: April 21, 2016
    Inventors: Tomasz P. Wikierak, Pawel M. Malinowski, Marcin J. Paprocki, Elisabeth Cura
  • Publication number: 20150240136
    Abstract: This present disclosure relates to a structural adhesive film suitable for bonding a first metal part and a second part, and in particular for hem flange bonding of a first metal part and second part. More specifically, the present disclosure is directed to a structural adhesive film comprising a thermosettable composition which comprises an epoxy compound having a selected average epoxy equivalent weight, a thermoplastic resin having a selected softening point, and an epoxy curing agent. The present disclosure further relates to a thermoset structural adhesive film obtainable by thermosetting of the structural adhesive film of the disclosure, and to a two-part assembly comprising such a thermoset structural adhesive film In another aspect, the present disclosure is directed to a method for bonding a first metal part and a second part, in particular for hem flange bonding of a first metal part and second part.
    Type: Application
    Filed: August 22, 2013
    Publication date: August 27, 2015
    Inventors: Sohaib Elgimiabi, Elisabeth Cura, Bernhard H. Koch, Nurettin Yavuz
  • Publication number: 20100142226
    Abstract: A lighting device comprises a side-light light guide (12) located in a support (13). To facilitate the location of the light guide (12) in the support (13) and ensure its retention in a predetermined orientation, at least one location feature (11) is formed on/in the light guide for engagement by the support. Advantageously, the/each location feature (11) has no substantial effect on the light output of the light guide through its light-emitting region (18).
    Type: Application
    Filed: August 10, 2007
    Publication date: June 10, 2010
    Applicant: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Hans-Michael Vogt, Mark Pilhofer, Christoph Michel, Carsten Sambraus, Norbert Schiffer, Ulrich Kunze, Joachim C.R. Licht, Elisabeth Cura
  • Patent number: 7651580
    Abstract: The invention relates to nanoparticulate preparations containing at least one mixed metal oxide in the form of supramagnetic, nanoscale particles, methods for heating such a preparation, and methods for producing and dissolving adhesive compounds on the basis of said preparations.
    Type: Grant
    Filed: December 15, 2008
    Date of Patent: January 26, 2010
    Assignee: Henkel Kommanditgesellschaft Auf Aktien (Henkel KGAA)
    Inventors: Hans-Martin Sauer, Elisabeth Cura, Sohaib Elgimiabi, Rolf Hempelmann, Frank Meyer, Stefan Spiekermann
  • Publication number: 20090133822
    Abstract: The invention relates to nanoparticulate preparations containing at least one mixed metal oxide in the form of supramagnetic, nanoscale particles, methods for heating such a preparation, and methods for producing and dissolving adhesive compounds on the basis of said preparations.
    Type: Application
    Filed: December 15, 2008
    Publication date: May 28, 2009
    Applicant: Henkel Kommanditgesellschaft auf Akitien (Henkel KGaA)
    Inventors: Hans-Martin Sauer, Elisabeth Cura, Sohaib Elgimiabi, Rolf Hempelmann, Frank Meyer, Stefan Spiekermann