Abstract: A mounting device for mounting electronic components, wherein the mounting device comprises a stack, in particular a layer stack configured as alternating sequence of at least one support structure for providing mechanical support and a plurality of thermally conductive and electrically insulating structures.

Abstract: A mounting device for mounting electronic components, wherein the mounting device comprises an electrically conductive structure having a first value of thermal expansion in at least one pre-defined spatial direction, an electrically insulating structure having a second value of thermal expansion in the at least one pre-defined spatial direction being different from the first value and being arranged on the electrically conductive structure, and a thermal expansion adjustment structure having a third value of thermal expansion in the at least one pre-defined spatial direction, wherein the third value is selected and the thermal expansion adjustment structure is located so that thermally induced warpage of the mounting device resulting from a difference between the first value and the second value is at least partially compensated by the thermal expansion adjustment structure.

Abstract: A composite structure for use as a constituent of a mounting device, wherein the composite structure comprises an electrically conductive carrier, an intermediate layer comprising adhesion promoting material and being arranged on the electrically conductive carrier, and a thermally conductive and electrically insulating layer on the intermediate layer.

Abstract: A mounting device for mounting electronic components, wherein the mounting device comprises a stack, in particular a layer stack configured as alternating sequence of at least one support structure for providing mechanical support and a plurality of thermally conductive and electrically insulating structures.

Abstract: A mounting device for mounting electronic components, wherein the mounting device comprises an electrically conductive structure having a first value of thermal expansion in at least one pre-defined spatial direction, an electrically insulating structure having a second value of thermal expansion in the at least one pre-defined spatial direction being different from the first value and being arranged on the electrically conductive structure, and a thermal expansion adjustment structure having a third value of thermal expansion in the at least one pre-defined spatial direction, wherein the third value is selected and the thermal expansion adjustment structure is located so that thermally induced warpage of the mounting device resulting from a difference between the first value and the second value is at least partially compensated by the thermal expansion adjustment structure.

Abstract: Electronic device comprising an at least partially electrically insulating carrier structure, which comprises a resin matrix and reinforcement structures in the resin matrix, wherein the reinforcement structures are provided at least partially with a thermal conductivity increasing coating, and an electrically conducting structure at and/or in the carrier structure, wherein at least in an interconnecting section between the carrier structure and the electrically conducting structure, the carrier structure is free from reinforcement structures provided with the coating, such that the electrically conducting structure and the coating are arranged non-contactingly relative to each other.

Abstract: Connection system for electronic components, the connection system comprising at least one electrically insulating layer and at least one electrically conductive layer, wherein the connection system further comprises a heat distributing layer arranged within the at least one electrically insulating layer wherein the at least one heat distributing layer is made of thermally conductive, and electrically insulating, matrix-free material.