Patents by Inventor Eliseo Chiaverina

Eliseo Chiaverina has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8112889
    Abstract: A method of manufacturing an ink jet printhead, including: arranging a nozzle plate in which there is formed a plurality of nozzles, the nozzle plate having an upper surface and a lower surface, the upper surface being on the side of the ejection of ink drops and the lower surface being opposite to the upper surface; depositing on the upper surface a first coating including a first layer including silicon carbide, while maintaining the nozzle plate at a first deposition temperature not larger than 250° C.; depositing on the lower surface a second coating including a second layer including silicon carbide, while maintaining the nozzle plate at a second deposition temperature not larger than 250° C.; positioning the nozzle plate onto the ink barrier layer by bringing into contact the second coating layer with the ink barrier layer. The first layer is deposited before the second layer.
    Type: Grant
    Filed: December 23, 2005
    Date of Patent: February 14, 2012
    Assignee: Telecom Italia S.p.A.
    Inventors: Danilo Bich, Eliseo Chiaverina, Francesca Pescarmona, Paolo Schina
  • Publication number: 20080313901
    Abstract: This invention relates to a method of manufacturing an ink jet printhead, said printhead comprising a substrate and an ink barrier layer formed on said substrate, said method comprising the steps of: arranging a nozzle plate in which there is formed a plurality of nozzles suitable for the ejection of ink drops, said nozzle plate comprising an upper surface and a lower surface, said upper surface being on the side of the ejection of ink drops and said lower surface being opposite to said upper surface; depositing on said upper surface a first coating including a first layer comprising silicon carbide, while maintaining said nozzle plate at a first deposition temperature not larger than 250° C.; depositing on said lower surface a second coating including a second layer comprising silicon carbide, while maintaining said nozzle plate at a second deposition temperature not larger than 250° C.
    Type: Application
    Filed: December 23, 2005
    Publication date: December 25, 2008
    Applicant: Telecom Italia S.p.A.
    Inventors: Danilo Bich, Eliseo Chiaverina, Francesca Pescarmona, Paolo Schina