Abstract: Disclosed herein is a composition comprising a regioregular oligothiophene, a regioregular poly[2,5-bis(3-alkylthiophen-2-yl)thieno(3,2-b)thiophene] and/or a benzothiophene; where the regioregular oligothiophene, the regioregular poly[2,5-bis(3-alkylthiophen-2-yl)thieno(3,2-b)thiophene] and the benzothiophene each have a number average molecular weight of less than or equal to 475 grams per mole; where the composition is melted and then annealed at a temperature between a melting point and a glass transition temperature of the composition; the composition having a charge mobility that is greater than a comparative composition that is either not annealed or annealed at the same temperature between the melting point and the glass transition temperature but without being subjected to prior melting.

Abstract: Arylclobutene-containing multi-functional monomers are useful in the preparation of arylcyclobutene-based polymer coatings. Compositions comprising one or more arylclobutene-containing multi-functional monomers and one or more oligomers comprising as polymerized units one or more arylcyclobutene monomer provide arylcyclobutene-based polymer coatings having reduced stress. Such compositions are useful in the manufacture of electronic devices.

Abstract: Compositions containing an adhesive material, a release additive and a compatibilizer are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate is desired.

Abstract: Disclosed herein is a composition comprising a regioregular polyalkylthiophene and/or a regioregular poly[2,5-bis(3-alkylthiophen-2-yl)thieno(3,2-b)thiophene]; where the composition is melted and then cooled to a temperature between a melting point and a glass transition temperature of the composition; the composition having an amount of crystallinity that is at least twice the amount of crystallinity of another identical composition that is crystallized by a method that does not involve melting and cooling to a temperature between the melting point and the glass transition temperature of the identical composition.

Abstract: Arylclobutene-containing multi-functional monomers are useful in the preparation of arylcyclobutene-based polymer coatings. Compositions comprising one or more arylclobutene-containing multi-functional monomers and one or more oligomers comprising as polymerized units one or more arylcyclobutene monomer provide arylcyclobutene-based polymer coatings having reduced stress. Such compositions are useful in the manufacture of electronic devices.

Abstract: Arylcyclobutene polymers having improved toughness are provided. Compositions and methods for coating arylcyclobutene polymers having improved toughness are also provided.

Abstract: Arylcyclobutene polymers having improved toughness are provided. Compositions and methods for coating arylcyclobutene polymers having improved toughness are also provided.

Abstract: Arylclobutene-containing multi-functional monomers are useful in the preparation of arylcyclobutene-based polymer coatings. Compositions comprising one or more arylclobutene-containing multi-functional monomers and one or more oligomers comprising as polymerized units one or more arylcyclobutene monomer provide arylcyclobutene-based polymer coatings having reduced stress. Such compositions are useful in the manufacture of electronic devices.

Abstract: Disclosed herein is a composition comprising a regioregular polyalkylthiophene and/or a regioregular poly[2,5-bis(3-alkylthiophen-2-yl)thieno(3,2-b)thiophene]; and a metallocene; where the metallocene is present in an amount of greater than 50 wt %, based on the total weight of the composition. Disclosed herein too is a method of manufacturing a thin film comprising dissolving a regioregular polyalkylthiophene or a regioregular poly[2,5-bis(3-alkylthiophen-2-yl)thieno(3,2-b)thiophene] in a solvent to form a solution; dissolving a metallocene in the solution; disposing the solution on a substrate; and annealing the substrate.

Abstract: Compositions containing an adhesive material, a release additive and a compatibilizer are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate is desired.

Abstract: Disclosed herein is a composition comprising a regioregular polyalkylthiophene and/or a regioregular poly[2,5-bis(3-alkylthiophen-2-yl)thieno(3,2-b)thiophene]; and a metallocene; where the metallocene is present in an amount of greater than 75 wt %, based on the total weight of the composition; where the charge mobility is increased by a factor of 3 or more over compositions having 50 wt % of ferrocene or less with the remainder being a regioregular polyalkylthiophene and/or a regioregular poly[2,5-bis(3-alkylthiophen-2-yl)thieno(3,2-b)thiophene].

Abstract: Compositions containing an adhesive material, a release additive and a compatibilizer are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate is desired.

Abstract: Disclosed herein is a composition comprising a regioregular oligothiophene, a regioregular poly[2,5-bis(3-alkylthiophen-2-yl)thieno(3,2-b)thiophene] and/or a benzothiophene; where the regioregular oligothiophene, the regioregular poly[2,5-bis(3-alkylthiophen-2-yl)thieno(3,2-b)thiophene] and the benzothiophene each have a number average molecular weight of less than or equal to 475 grams per mole; where the composition is melted and then annealed at a temperature between a melting point and a glass transition temperature of the composition; the composition having a charge mobility that is greater than a comparative composition that is either not annealed or annealed at the same temperature between the melting point and the glass transition temperature but without being subjected to prior melting.

Abstract: Disclosed herein is a composition comprising a regioregular polyalkylthiophene and/or a regioregular poly[2,5-bis(3-alkylthiophen-2-yl)thieno(3,2-b)thiophene]; and a metallocene; where the metallocene is present in an amount of greater than 75 wt %, based on the total weight of the composition; where the charge mobility is increased by a factor of 3 or more over compositions having 50 wt % of ferrocene or less with the remainder being a regioregular polyalkylthiophene and/or a regioregular poly[2,5-bis(3-alkylthiophen-2-yl)thieno(3,2-b)thiophene].

Abstract: Disclosed herein is a composition comprising a regioregular polyalkylthiophene and/or a regioregular poly[2,5-bis(3-alkylthiophen-2-yl)thieno(3,2-b)thiophene]; and a metallocene; where the metallocene is present in an amount of greater than 50 wt %, based on the total weight of the composition. Disclosed herein too is a method of manufacturing a thin film comprising dissolving a regioregular polyalkylthiophene or a regioregular poly[2,5-bis(3-alkylthiophen-2-yl)thieno(3,2-b)thiophene] in a solvent to form a solution; dissolving a metallocene in the solution; disposing the solution on a substrate; and annealing the substrate.

Abstract: Compositions containing an adhesive material, a release additive and a compatibilizer are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate is desired.

Abstract: Silver electroplating baths having certain sulfide compounds and methods of electrodepositing a silver-containing layer using these baths are disclosed. Such electroplating baths are useful to provide silver-containing solder deposits having reduced void formation and improved within-die uniformity.

Abstract: Tin-silver alloy electroplating baths having certain amine-oxide surfactants and methods of electrodepositing a tin-silver-containing layer using these baths are disclosed. Such electroplating baths are useful to provide tin-silver solder deposits having reduced void formation and improved within-die uniformity.

Abstract: Disclosed herein is a composition comprising a regioregular polyalkylthiophene and/or a regioregular poly[2,5-bis(3-alkylthiophen-2-yl)thieno(3,2-b)thiophene]; where the composition is melted and then cooled to a temperature between a melting point and a glass transition temperature of the composition; the composition having an amount of crystallinity that is at least twice the amount of crystallinity of another identical composition that is crystallized by a method that does not involve melting and cooling to a temperature between the melting point and the glass transition temperature of the identical composition.

Abstract: Silver electroplating baths having certain sulfide compounds and methods of electrodepositing a silver-containing layer using these baths are disclosed. Such electroplating baths are useful to provide silver-containing solder deposits having reduced void formation and improved within-die uniformity.