Abstract: A halogen-free resin composition includes (A) 100 parts by weight of naphthalene epoxy resin; (B) 10 to 100 parts by weight of styrene maleic anhydride copolymer; and (C) 30 to 70 parts by weight of DOPO-containing bisphenol F novolac resin. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby attain a low dielectric constant, a low dielectric dissipation factor, high heat resistance, and high flame retardation, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper clad laminates and printed circuit boards.

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 10 to 100 parts by weight of benzoxazine resin; (C) 5 to 50 parts by weight of diallylbisphenol A resin; and (D) 0.05 to 20 parts by weight of an amine curing agent. The halogen-free resin composition includes specific ingredients and proportions thereof to attain low dielectric constant (Dk), low dissipation factor (Df), high heat resistance, and high flame retardation. The halogen-free resin composition is suitable for producing a prepreg or a resin film and thus applicable to copper clad laminates and printed circuit boards.

Abstract: An inorganic filler containing (1) from 62 to 80 parts by weight of SiO2; (2) from 0 to 10 parts of weight of Al2O3; (3) from 20 to 30 parts by weight of B2O3; and (4) from 0 to 5 parts by weight of Na2O or K2O or a combination of both; based on a total weight of the filler, and the inorganic filler having a maximum particle diameter below 100 ?m is introduced. A resin composition containing the inorganic filler and applied for manufacturing printed circuit boards is also introduced, and a laminate prepared by the inorganic filler provides a good drilling function and a good dielectric performance. The laminate manufactured by adopting the inorganic filler is used for manufacturing high frequency transmission printed circuit board with a good high frequency transmission function.

Abstract: An inorganic filler containing (1) from 50 to 60 parts by weight of SiO2; (2) from 5 to 20 parts by weight of Al2O3; (3) from 0 to 10 parts by weight of CaO; (4) from 15 to 30 parts by weight of B2O3; (5) from 0 to 5 parts by weight of MgO; (6) from 0 to 1 parts by weight of Na2O, K2O or a combination of both; and (7) from 0 to 5 parts by weight of TiO2; based on a total weight of the filler, and having a maximum particle diameter below 100 ?m is introduced. A resin composition containing the inorganic filler and application in printed circuit boards are also introduced. A laminate prepared by the inorganic filler provides a good drilling function, a good dielectric performance and a good high frequency transmission function in high frequency transmission printed circuit board.