Patents by Inventor Elizabeth C. Galindo

Elizabeth C. Galindo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High performance package using high dielectric constant materials for power/ground and low dielectric constant materials for signal lines
    Patent number: 5371403
    Abstract: A multi-layer package for semiconductor dies using two different types of dielectric materials improves the performance of a semiconductor package. The first material having a high dielectric constant is placed between the power and ground planes to form a decoupling capacitor and the second material having a low dielectric constant is used to contact the signal traces. Silicon carbide is preferred for the high dielectric constant material.
    Type: Grant
    Filed: September 24, 1993
    Date of Patent: December 6, 1994
    Assignee: VLSI Technology, Inc.
    Inventors: Chin-Ching Huang, Elizabeth C. Galindo