Abstract: Methods, systems, and computer program products for direct assignment of physical devices to confidential virtual machines (VMs). At a first guest privilege context of a guest partition, a direct assignment of a physical device associated with a host computer system to the guest partition is identified. The guest partition includes the first guest privilege context and a second guest privilege context, which is restricted from accessing memory associated with the first guest privilege context. The guest partition corresponds to a confidential VM, such that a memory region associated with the guest partition is inaccessible to a host operating system. It is determined, based on a policy, that the physical device is allowed to be directly assigned to the guest partition. Communication between the physical device and the second guest privilege context is permitted, such as by exposing the physical device on a virtual bus and/or forwarding an interrupt.

Abstract: A silicone pressure sensitive adhesive composition contains an alkenyl-functional polydiorganosiloxane gum, a polyorganosilicate resin, a polyorganohydrogensiloxane crosslinker, a migration reducing additive, a hydrosilylation reaction catalyst, a hydrosilylation reaction inhibitor, and a solvent. Methods for preparing the silicone pressure sensitive adhesive composition and using it to form a protective film are provided.

Abstract: A silicone pressure sensitive adhesive composition contains an alkenyl-functional polydiorganosiloxane gum, a polyorganosilicate resin, a polyorganohydrogensiloxane crosslinker, a migration reducing additive, a hydrosilylation reaction catalyst, a hydrosilylation reaction inhibitor, and a solvent. Methods for preparing the silicone pressure sensitive adhesive composition and using it to form a protective film are provided.

Abstract: A silicone pressure sensitive adhesive composition contains an alkenyl-functional polydiorganosiloxane gum, a polyorganosilicate resin, a polyorganohydrogensiloxane crosslinker, a migration reducing additive, a hydrosilylation reaction catalyst, a hydrosilylation reaction inhibitor, and a solvent. Methods for preparing the silicone pressure sensitive adhesive composition and using it to form a protective film are provided.

Abstract: A polydiorganosiloxane having a silicon bonded poly(meth)acrylate polymer or copolymer is useful in a polyorganosiloxane hybrid pressure sensitive adhesive composition that cures to form a polyorganosiloxane hybrid pressure sensitive adhesive. An adhesive article including the polyorganosiloxane hybrid pressure sensitive adhesive is also disclosed.

Abstract: A polydiorganosiloxane having both a silicon bonded aliphatically unsaturated group and a silicon bonded poly(meth)acrylate polymer or copolymer is useful in a polyorganosiloxane hybrid pressure sensitive adhesive composition that cures to form a polyorganosiloxane hybrid pressure sensitive adhesive. The polyorganosiloxane hybrid pressure sensitive adhesive composition can be wet-cast or dry-cast on a substrate and cured to form a polyorganosiloxane hybrid pressure sensitive adhesive article. An adhesive article including the polyorganosiloxane hybrid pressure sensitive adhesive is also disclosed.

Abstract: The invention provides a process for the production of a pressure sensitive adhesive, comprising dissolving a particulate solid MQ silicone resin having a bulk density in the range 0.4-0.9 g/cm3 in a volatile solvent, and dissolving a polydiorganosiloxane having a viscosity of 0.1 to 40,000 Pa·s at 25° C. in the volatile solvent before, simultaneously with or after dissolving the solid MQ silicone resin. The process of the present invention allows the production of a pressure sensitive adhesive in a solvent different from the solvent in which the MQ silicone resin was prepared.

Abstract: The invention provides a process for the production of a pressure sensitive adhesive, comprising dissolving a particulate solid MQ silicone resin having a bulk density in the range 0.4-0.9 g/cm3 in a volatile solvent, and dissolving a polydiorganosiloxane having a viscosity of 0.1 to 40,000 Pa·s at 25° C. in the volatile solvent before, simultaneously with or after dissolving the solid MQ silicone resin. The process of the present invention allows the production of a pressure sensitive adhesive in a solvent different from the solvent in which the MQ silicone resin was prepared.