Abstract: A method of fabricating an IC includes forming a layer stack thereon including silicon nitride layer on a first silicon oxide layer, with a second silicon oxide layer thereon on a substrate including a semiconductor material. The layer stack is etched to form ?1 trench that is at least 2 microns deep into the semiconductor material. A dielectric liner is formed on sidewalls and a bottom of the trench. A polysilicon layer is formed on the dielectric liner that fills the trench and extends lateral to the trench. Chemical mechanical planarization (CMP) processing stops on the silicon nitride layer to remove the polysilicon layer and the second silicon oxide layer to form a trench structure having a polysilicon fill. After the CMP processing, thermal oxidation oxidizes exposed regions of the polysilicon layer to form a polysilicon oxide layer. After the thermal oxidizing, the silicon nitride layer is removed.

Abstract: A method of fabricating an IC includes forming a layer stack thereon including silicon nitride layer on a first silicon oxide layer, with a second silicon oxide layer thereon on a substrate including a semiconductor material. The layer stack is etched to form ?1 trench that is at least 2 microns deep into the semiconductor material. A dielectric liner is formed on sidewalls and a bottom of the trench. A polysilicon layer is formed on the dielectric liner that fills the trench and extends lateral to the trench. Chemical mechanical planarization (CMP) processing stops on the silicon nitride layer to remove the polysilicon layer and the second silicon oxide layer to form a trench structure having a polysilicon fill. After the CMP processing, thermal oxidation oxidizes exposed regions of the polysilicon layer to form a polysilicon oxide layer. After the thermal oxidizing, the silicon nitride layer is removed.

Abstract: The invention provides shelf stable dry mix compositions for use in preparing a baked good, the dry mix compositions including flour, sweetening agent, wherein a portion of the sweetening agent is liquid corn syrup, and fat source. Optionally, the dry mix compositions include leavening systems. Methods of making shelf stable dry mixes are also described.

Abstract: The invention provides shelf stable dry mix compositions for use in preparing a baked good, the dry mix compositions including flour, sweetening agent, wherein a portion of the sweetening agent is corn syrup, and fat source. Optionally, the dry mix compositions include leavening systems. Methods of making shelf stable dry mixes are also described.

Abstract: The invention provides an edible composition having a controlled viscosity profile, the composition composed of sweetening agent, shortening, emulsifier, and viscosity enhancer comprising cellulose, starch, and polysaccharide gum. Preferably, the inventive topping composition has a moisture content in the range of 10 to 20%. The controlled viscosity profile includes an initial viscosity at ambient temperatures, an intermediate, flowable viscosity at elevated temperatures, and a final, set, texture when cooled that resembles the initial viscosity.