Abstract: One embodiment relates to an earth-penetrating apparatus. The apparatus includes a pole with a hollow portion therein and a bottom end which is configured to be driven into ground. Anchoring parts are configured to be radially extendable from the pole. In addition, an expansion mechanism is configured to apply a force to the anchoring parts so as to radially extend the anchoring parts from the pole after the pole has been driven into the ground. Another embodiment relates to a solar collector arrangement that includes a plurality of earth-penetrating anchors. Other embodiments, aspects and features are also disclosed.

Abstract: One embodiment relates to an earth-penetrating apparatus. The apparatus includes a pole with a hollow portion therein and a bottom end which is configured to be driven into ground. Anchoring parts are configured to be radially extendable from the pole. In addition, an expansion mechanism is configured to apply a force to the anchoring parts so as to radially extend the anchoring parts from the pole after the pole has been driven into the ground. Another embodiment relates to a solar collector arrangement that includes a plurality of earth-penetrating anchors. Other embodiments, aspects and features are also disclosed.

Abstract: One embodiment relates to a photovoltaic (PV) module assembly with integrated junctions manufactured in a factory. The assembly includes a plurality of PV laminates and a frame surrounding and supporting each of the PV laminates in the module. A plurality of environmentally-protected electrical junctions interconnect the photovoltaic laminates. Another embodiment relates to a method of manufacturing a PV module assembly in which pin terminals of PV laminates are inserted into corresponding sockets of junction boxes that are integrated into a frame of the assembly. Another embodiment relates to a method of manufacturing a PV module assembly in which non-insulated conductors are extended from PV laminates, electrical junctions are formed between the conductors, and material is applied to encapsulate the junctions. Other embodiments and features are also disclosed.