Abstract: Dual-side unfolding building modules are described that allow buildings with greater design flexibility, and particularly, large and open work or living spaces while allowing interesting roof designs such as butterfly type roofs. The building modules fold compactly for transport. The building modules can be prefabricated with interior and exterior finishing material thereby reducing the time required for finishing at the building site.

Abstract: Foldable building units are provided based on structural frame and connection assembly designs that enable greater construction efficiency and flexibility. The structural frame and connection assembly designs allow for easier connection of frame elements in the prefabrication process of the foldable building units and for easier connection of frame elements at the building site, for example, of foldably connected frame elements after unfolding. They also allow for more finish in the prefabrication process, and/or less and faster work at the building site, for example, by enabling conventional structural lumber grids that can be continuous through the edges and corners of the building envelope for conventional exterior finishing, while providing a tight building envelope with reduced heat transfer, particularly, through the edges of the foldable building unit.

Abstract: Buildings are described that incorporate at least a folding building module and a complementary building module that also can be a folding building module. The building modules can be shipped to the building site separately and can be unfolded and connected quickly. The described foldable houses and buildings exhibit more design flexibility, are formed from easily transported building modules, and/or allow folded building modules that are substantially in finished condition. Additionally, methods for forming the buildings and houses are described.

Abstract: Dual-side unfolding building modules are described that allow buildings with greater design flexibility, and particularly, large and open work or living spaces while allowing interesting roof designs such as butterfly type roofs. The building modules fold compactly for transport. The building modules can be prefabricated with interior and exterior finishing material thereby reducing the time required for finishing at the building site.

Abstract: Foldable building units are provided based on structural frame and connection assembly designs that enable greater construction efficiency and flexibility. The structural frame and connection assembly designs allow for easier connection of frame elements in the prefabrication process of the foldable building units and for easier connection of frame elements at the building site, for example, of foldably connected frame elements after unfolding. They also allow for more finish in the pre-fabrication process, and/or less and faster work at the building site, for example, by enabling conventional structural lumber grids that can be continuous through the edges and corners of the building envelope for conventional exterior finishing, while providing a tight building envelope with reduced heat transfer, particularly, through the edges of the foldable building unit.

Abstract: New etch barriers of indium-tin-oxide in the manufacturing process of thin film transistor-liquid crystal display are self-assembled monolayers, such as n-alkylsilanes. A typical process of applying a self-assembled monolayer is to ink a hydrolyzed n-octadecyltrimethoxysilane solution on to a stamp and then to transfer the solution onto ITO. The surface of the stamp may be polar enough to be wet with polar self-assembled monolayer solutions of an akylsilane. A non-polar stamp surface may be treated with oxygen plasma to obtain a wettable polar surface.

Abstract: New etch barriers of indium-tin-oxide in the manufacturing process of thin film transistor-liquid crystal display are self-assembled monolayers, such as n-alkylsilanes. A typical process of applying a self-assembled monolayer is to ink a hydrolyzed n-octadecyltrimethoxysilane solution on to a stamp and then to transfer the solution onto ITO. The surface of the stamp may be polar enough to be wet with polar self-assembled monolayer solutions of an akylsilane. A non-polar stamp surface may be treated with oxygen plasma to obtain a wettable polar surface.

Abstract: New etch barriers of indium-tin-oxide in the manufacturing process of thin film transistor-liquid crystal display are self-assembled monolayers, such as n-alkylsilanes. A typical process of applying a self-assembled monolayer is to ink a hydrolyzed n-octadecyltrimethoxysilane solution on to a stamp and then to transfer the solution onto ITO. The surface of the stamp may be polar enough to be wet with polar self-assembled monolayer solutions of an akylsilane. A non-polar stamp surface may be treated with oxygen plasma to obtain a wettable polar surface.

Abstract: A layered structure and process for a microcontact printing stamp has individual layers chosen to impart particular properties such as one layer chosen for surface properties and another layer chosen for bulk mechanical properties. The invention is fabricated through having a first layer with coatable properties and a subsequent layer with injectable properties resulting in a layered structure wherein the layer at the surface has optimized surface properties and is positioned on an underlying layer with carefully chosen bulk mechanical properties, and other unique functional properties can be imparted through an intermediate layer. A fabrication process is provided that employs a coating capability for one portion, an injection capability for another property and a porosity property for still another portion.

Abstract: New etch barriers of indium-tin-oxide in the manufacturing process of thin film transistor-liquid crystal display are self-assembled monolayers, such as n-alkylsilanes. A typical process of applying a self-assembled monolayer is to ink a hydrolyzed n-octadecyltrimethoxysilane solution on to a stamp and then to transfer the solution onto ITO. The surface of the stamp may be polar enough to be wet with polar self-assembled monolayer solutions of an akylsilane. A non-polar stamp surface may be treated with oxygen plasma to obtain a wettable polar surface.

Abstract: Microcontact printing to pattern a self-assembled monolayer (SAM) of an alkanephosphonic acid on a film of indium zinc oxide (IZO). The SAM is robust enough to protect the undelying IZO from wet chemical etching, and thus defines a pattern of IZO on the substrate. In the microcontact printing process, a patterned, elastomeric stamp is inked with a solution of octadecylphosphonic acid and brought into conformal contact with the IZO surface. A SAM of alkanesulfonic acid forms where the stamp and the surface make contact; the rest remains underivatized. The stamp is then removed from the surface. Etching the sample in aqueous oxalic acid removes the unprotected areas, while the areas protected by the SAM remain in place.