Abstract: An RFID device includes a substrate and a lead frame secured to the substrate. The lead frame includes a pair of connection pads formed of a conductive material. An RFID chip and an antenna are electrically coupled to the lead frame. The width of the lead frame is substantially equal to the height of the lead frame. The connection pads of the lead frame may be oriented, among other options, along a direction parallel to a height of the substrate or along a direction parallel to a width of the substrate.

Abstract: An RFID device includes an antenna that is formed so as to control the optical properties of the RFID device, which may include minimizing the amount of light that will be transmitted through the RFID device or allowing for the passage of a predetermined amount of light therethrough. The RFID device includes a conductive material associated with a substrate. The conductive material includes an antenna and a periphery. An RFID chip is electrically coupled to the antenna, but not to the periphery. The antenna may be defined by a cutting or etching or printing process. A gap between the antenna and the periphery may be on the order of approximately 25 ?m-200 ?m (if the transmission of light through the RFID device is to be minimized) or greater in at least one section (if the passage of a predetermined amount of light through the RFID device would be desirable).

Abstract: An RFID device includes a substrate and a lead frame secured to the substrate. The lead frame includes a pair of connection pads formed of a conductive material. An RFID chip and an antenna are electrically coupled to the lead frame. The width of the lead frame is substantially equal to the height of the lead frame. The connection pads of the lead frame may be oriented, among other options, along a direction parallel to a height of the substrate or along a direction parallel to a width of the substrate.