Patents by Inventor Elka Trileva

Elka Trileva has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090073447
    Abstract: The invention provides a chip comprising a substrate with at least one surface and a layer of particles having a non-metallic core and a coating made of a metal or a metal alloy, characterized in that each non-metallic core, on average, forms a metal-surrounded contact point with at least one other non-metallic core and/or the substrate surface. The invention also provides a method for preparing a chip, comprising the steps of, adsorbing non-metallic particles on said surface of the substrate, and, subsequently, adsorbing colloids of a metal on said non-metallic particles to provide the shell made of a metal or a metal alloy, and a chip which is obtainable by said method. The chip can be employed in optical devices for the detection of analytes.
    Type: Application
    Filed: April 21, 2006
    Publication date: March 19, 2009
    Applicant: FUJIREBIO INC.
    Inventors: Reiner Dahint, Petra Bucker, Elka Trileva, Soren Schilp, Michael Himmelhaus, Hatice Acunman