Abstract: One illustrative method disclosed herein includes performing an atomic layer deposition (ALD) process at a temperature of less than 400° C. to deposit a layer of silicon dioxide on a germanium-containing region of semiconductor material and forming a gate structure of a transistor device above the layer of silicon dioxide.

Abstract: Methods of forming a device structure for a field-effect transistor and device structures for a field-effect transistor. A first gate dielectric layer is formed on a semiconductor layer in a first area. A hardmask layer is formed on the first gate dielectric layer in the first area of the semiconductor layer. A gate stack layer is formed on the semiconductor layer in a second area and on the hardmask layer in the first area of the semiconductor layer. The hardmask layer separates the gate stack layer from the first gate dielectric layer on the first area of the semiconductor layer.

Abstract: Methods of forming a device structure for a field-effect transistor and device structures for a field-effect transistor. A first gate dielectric layer is formed on a semiconductor layer in a first area. A hardmask layer is formed on the first gate dielectric layer in the first area of the semiconductor layer. A gate stack layer is formed on the semiconductor layer in a second area and on the hardmask layer in the first area of the semiconductor layer. The hardmask layer separates the gate stack layer from the first gate dielectric layer on the first area of the semiconductor layer.

Abstract: When forming field effect transistors, a common problem is the formation of a Schottky barrier at the interface between a metal thin film in the gate electrode and a semiconductor material, typically polysilicon, formed thereupon. Fully silicided gates are known in the state of the art which may overcome this problem. The claimed method proposes an improved fully silicided gate achieved by forming a gate structure including an additional metal layer between the metal gate layer and the gate semiconductor material. A silicidation process can then be optimized so as to form a lower metal silicide layer comprising the metal of the additional metal layer and an upper metal silicide layer forming an interface with the lower metal silicide layer.

Abstract: A method for forming a transistor device is disclosed that includes forming a first gate electrode on a substrate, forming a nitride layer, in particular an SiN layer, over the first gate electrode and forming a first strained layer over the nitride layer, in particular the SiN layer. A transistor device is also disclosed that includes a first gate electrode, a nitride layer, in particular an SiN layer, formed over the first gate electrode and a first strained layer formed over the nitride layer, in particular the SiN layer.

Abstract: When forming field effect transistors, a common problem is the formation of a Schottky barrier at the interface between a metal thin film in the gate electrode and a semiconductor material, typically polysilicon, formed thereupon. Fully silicided gates are known in the state of the art which may overcome this problem. The claimed method proposes an improved fully silicided gate achieved by forming a gate structure including an additional metal layer between the metal gate layer and the gate semiconductor material. A silicidation process can then be optimized so as to form a lower metal silicide layer comprising the metal of the additional metal layer and an upper metal silicide layer forming an interface with the lower metal silicide layer.

Abstract: One illustrative method disclosed herein includes performing an atomic layer deposition (ALD) process at a temperature of less than 400° C. to deposit a layer of silicon dioxide on a germanium-containing region of semiconductor material and forming a gate structure of a transistor device above the layer of silicon dioxide.

Abstract: Methods for fabricating integrated circuits are provided. In an embodiment, a method for fabricating an integrated circuit includes providing a semiconductor substrate and forming a gate structure on the semiconductor substrate. The gate includes a high-k dielectric material. In the method, a fluorine-containing liquid is contacted with the high-k dielectric material and fluorine is incorporated into the high-k dielectric material.

Abstract: Generally, the present disclosure is directed to techniques for improving the reliability of semiconductor devices with high-k gate dielectric layers by passivating point defects during the gate stack formation. One illustrative method disclosed herein includes performing a plurality of material deposition cycles to form a high-k dielectric layer above a semiconductor material layer, and introducing a passivating material into a gaseous precursor that is used for forming the high-k dielectric layer during at least one of the plurality of material deposition cycles.

Abstract: Methods are provided for fabricating an integrated circuit that includes metal filled narrow openings. In accordance with one embodiment a method includes forming a dummy gate overlying a semiconductor substrate and subsequently removing the dummy gate to form a narrow opening. A layer of high dielectric constant insulator and a layer of work function-determining material are deposited overlying the semiconductor substrate. The layer of work function-determining material is exposed to a nitrogen ambient in a first chamber. A layer of titanium is deposited into the narrow opening in the first chamber in the presence of the nitrogen ambient to cause the first portion of the layer of titanium to be nitrided. The deposition of titanium continues, and the remaining portion of the layer of titanium is deposited as substantially pure titanium. Aluminum is deposited overlying the layer of titanium to fill the narrow opening and to form a gate electrode.

Abstract: Methods for fabricating integrated circuits are provided. In an embodiment, a method for fabricating an integrated circuit includes providing a semiconductor substrate and forming a gate structure on the semiconductor substrate. The gate includes a high-k dielectric material. In the method, a fluorine-containing liquid is contacted with the high-k dielectric material and fluorine is incorporated into the high-k dielectric material.

Abstract: When forming sophisticated circuit elements, such as transistors, capacitors and the like, using a combination of a conventional dielectric material and a high-k dielectric material, superior performance and reliability may be achieved by forming a hafnium oxide-based high-k dielectric material on a conventional dielectric layer with a preceding surface treatment, for instance using APM at room temperature. In this manner, sophisticated transistors of superior performance and with improved uniformity of threshold voltage characteristics may be obtained, while also premature failure due to dielectric breakdown, hot carrier injection and the like may be reduced.

Abstract: Generally, the present disclosure is directed to techniques for improving the reliability of semiconductor devices with high-k gate dielectric layers by passivating point defects during the gate stack formation. One illustrative method disclosed herein includes performing a plurality of material deposition cycles to form a high-k dielectric layer above a semiconductor material layer, and introducing a passivating material into a gaseous precursor that is used for forming the high-k dielectric layer during at least one of the plurality of material deposition cycles.

Abstract: Methods are provided for fabricating an integrated circuit that includes metal filled narrow openings. In accordance with one embodiment a method includes forming a dummy gate overlying a semiconductor substrate and subsequently removing the dummy gate to form a narrow opening. A layer of high dielectric constant insulator and a layer of work function-determining material are deposited overlying the semiconductor substrate. The layer of work function-determining material is exposed to a nitrogen ambient in a first chamber. A layer of titanium is deposited into the narrow opening in the first chamber in the presence of the nitrogen ambient to cause the first portion of the layer of titanium to be nitrided. The deposition of titanium continues, and the remaining portion of the layer of titanium is deposited as substantially pure titanium. Aluminum is deposited overlying the layer of titanium to fill the narrow opening and to form a gate electrode.

Abstract: Methods are provided for fabricating integrated circuits having controlled threshold voltages. In accordance with one embodiment a method includes forming a gate dielectric overlying an N-doped silicon substrate and depositing a layer of titanium nitride and a layer of tantalum nitride overlying the gate dielectric. A sub-monolayer of tantalum oxide is deposited overlying the layer of tantalum nitride by a process of atomic layer deposition, and oxygen is diffused from the tantalum oxide through the tantalum nitride and titanium nitride.

Abstract: Methods are provided for fabricating integrated circuits having controlled threshold voltages. In accordance with one embodiment a method includes forming a gate dielectric overlying an N-doped silicon substrate and depositing a layer of titanium nitride and a layer of tantalum nitride overlying the gate dielectric. A sub-monolayer of tantalum oxide is deposited overlying the layer of tantalum nitride by a process of atomic layer deposition, and oxygen is diffused from the tantalum oxide through the tantalum nitride and titanium nitride.

Abstract: The present invention relates to a method for depositing a dielectric material comprising a transition metal compound. After providing a substrate, a first pre-cursor comprising a transition metal compound and a second pre-cursor predominantly comprising at least one of water vapour, ammonia and hydrazine are successively applied on the substrate for forming a first layer of transition metal containing material. In a next step the first pre-cursor and a third pre-cursor comprising at least one of ozone and oxygen are successively applied on the first layer for forming a second layer of the transition metal containing material.

Abstract: A polycrystalline dielectric layer is formed wherein the dielectric layer comprises a first dielectric material containing an oxide or nitride and a second material contributing to less than 1% in weight to the dielectric layer, forming a non-conductive oxide or nitride having an enthalpy lower than the enthalpy of the first dielectric material such that a leakage current along grain boundaries of the first dielectric material is reduced.

Abstract: The present invention relates to a deposition of a dielectric layer. On a substrate having a structured area a crystallization seed layer for a dielectric layer is deposited via an atomic layer deposition technique employing a first and a second precursor on the structured area of the substrate. The first pre-cursor is a compound having the constitutional formula M1(R1Cp)x(R2)4-x, wherein M1 is one of hafnium and zirconium, Cp is cyclopentadienyl, R1 is independently selected of methyl, ethyl and alkyl, R2 is independently selected of hydrogen, methyl, ethyl, alkyl and alkoxyl, and x is one or two. The dielectric layer is deposited on the crystallization seed layer via an atomic layer deposition technique employing a third and a forth precursor wherein the third pre-cursor being a compound having the constitutional formula M2 R3 R4 R5 R6, wherein M2 is one of hafnium or zirconium and R3, R4, R5, and R6 are independently selected of alkyl amines.

Abstract: The present invention relates to a method for depositing a dielectric material comprising a transition metal compound. After providing a substrate, a first pre-cursor comprising a transition metal compound and a second pre-cursor predominantly comprising at least one of water vapour, ammonia and hydrazine are successively applied on the substrate for forming a first layer of transition metal containing material. In a next step the first pre-cursor and a third pre-cursor comprising at least one of ozone and oxygen are successively applied on the first layer for forming a second layer of the transition metal containing material.