Abstract: The image recording apparatus (3) of small dimensions includes a sensor (4) and a lens assembly formed of focussing lenses (8, 9, 10) arranged in a frame (12). The sensor is arranged on a first face (16) of a support (18), which has an aperture (20) facing which is arranged the photosensitive surface (6) of said sensor. On the other side, on the second face (22) of the support is arranged the lens assembly frame such that the lenses are substantially aligned with the support aperture and the photosensitive surface. The sensor is formed of a semiconductor substrate defining the photosensitive surface and having at the periphery thereof pads or bumps for electric contact with the support.

Abstract: The image recording apparatus (3) of small dimensions includes a sensor (4) and a lens assembly with focussing lenses (8, 9, 10) arranged in a frame (12). The sensor is arranged on a first face (16) of the substrate (18), which has an aperture (20) facing which the photosensitive surface (6) of said sensor is arranged. Means for positioning the lens assembly during assembly thereof are provided, formed particularly by an optical element (11).

Abstract: Method for welding two end portions (6, 8) of a coil (not shown) onto two electric contact pads or bumps (24, 26) of an integrated circuit (2) or an electronic unit of small dimensions. This welding method is characterised in that, prior to the actual welding step, a preliminary step is provided consisting in removing at least partially the insulating sheath from the electric wire (10) at least at the locations of the two end portions (6, 8) provided for the welding onto said electric contact pads or bumps (24, 26). The insulating sheath is removed locally by means of heat application, in particular using a heating press (58) working at a sufficiently high temperature to melt or sublimate the insulating sheath. The welding step is achieved at a much lower temperature than the temperature of the preliminary step, which allows the heat and mechanical stress to be reduced for the integrated circuit (2) and the bumps (24, 26) during welding of the ends (6, 8) onto said bumps.

Abstract: A manufacturing method for electronic components (1) including a coil (10), in which a distributing device (34), carrying a pay-out reel (24) on which is wound a winding wire (6), places the wire (6) in contiguous regular turns (8) onto a core (2), this method being characterised in that a flux of ionised air is forced to flow onto the coil (10) during manufacturing to remove electrostatic charges produced during the winding of the coil.

Abstract: There is disclosed a semiconductor chip and a method of directing a first writing laser beam and a second scanning laser beam across the surface of the semiconductor chip. The semiconductor chip includes first and second edges and a recognition pattern to be scanned by the scanning laser beam to facilitate the control of the relative movement of the semiconductor chip and the writing laser beam. The recognition pattern includes a pair of first enter codes disposed respectively along the first and second edges. Each of the first enter codes includes a synchronization mark and a step recognition mark disposed behind the synchronization mark considering that the scanning laser beam is directed from its edge to first scan the synchronization mark and then the step recognition mark.