Abstract: A process for manufacturing a metallized substrate using the island coating method, includes depositing a coating layer containing a radiation curable non-volatile film former. The coated part is then vacuum metallized to form the metal islands of the present invention. A layer of clear resinous protective dielectric topcoat containing a radiation curable non-volatile film former is then deposited to completely cover the layer of metal islands while maintaining the aesthetic properties of the metallizing island coating system at a reduced cost and with minimal variability among parts.

Abstract: A process for manufacturing a metallized substrate using the island coating method, includes depositing a coating layer containing a radiation curable non-volatile film former. The coated part is then vacuum metallized to form the metal islands of the present invention. A layer of clear resinous protective dielectric topcoat containing a radiation curable non-volatile film former is then deposited to completely cover the layer of metal islands while maintaining the aesthetic properties of the metallizing island coating system at a reduced cost and with minimal variability among parts.

Abstract: A test mold assembly for evaluating the surface deformation tendency of a coverstock bonded to a reactive plastic formulation to voids in the formulation including a base adapted to support a coverstock and spaced side walls extending upwardly from the base to define a mold cavity for receiving foam precursors. The assembly further includes a lid adapted to form the top of the mold cavity and having a cover portion disposed spaced from the base. The lid includes a plurality of integral projections extending downwardly from the cover portion into the mold cavity a predetermined distance to create voids in the foam. A method of making a foam void model for evaluating the surface deformation tendency of a coverstock bonded to a reactive plastic formulation to voids in the formulation is also disclosed.