Patents by Inventor Ellen S. Tormey
Ellen S. Tormey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220119315Abstract: LTCC devices are produced from dielectric compositions include a mixture of precursor materials that, upon firing, forms a dielectric material having a magnesium-silicon oxide host. An associated Ag system for LTCC conductors is also described.Type: ApplicationFiled: February 4, 2021Publication date: April 21, 2022Inventors: Ellen S. Tormey, Peter Marley, Chao Ma, John Maloney, Yi Yang, Orville W. Brown, Srinivasan Sridharan
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Patent number: 10625356Abstract: A thermal managing electrical connection tape includes a carrier film and a composition including solder powder, with the composition being applied to the carrier film. The composition includes a soldering flux having the solder powder disposed therein. The composition contains between about 50 wt % and about 70 wt % soldering flux. The composition further contains between about 30 wt % and about 50 wt % solder powder. A method of fabricating a thermal managing electrical connection tape includes providing a composition including at least one of a soldering flux and epoxy and/or acrylic, adding a solder powder to the composition, casting the composition on a carrier film, drying the carrier film in a drying furnace to form a dried tape, and cutting the dried tape to a desired width to form a thermal managing electrical connection tape.Type: GrantFiled: February 10, 2016Date of Patent: April 21, 2020Assignee: ALPHA ASSEMBLY SOLUTIONS INC.Inventors: Steven Dane Prokopiak, Sanyogita Arora, Ranjit S. Pandher, Ellen S. Tormey, Bawa Singh
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Patent number: 10562809Abstract: A low K value, high Q value, low firing dielectric material and method of forming a fired dielectric material. The dielectric material can be fired below 950° C. or below 1100° C., has a K value of less than about 8 at 10-30 GHz and a Q value of greater than 500 or greater than 1000 at 10-30 GHz. The dielectric material includes, before firing a solids portion including 10-95 wt % or 10-99 wt % silica powder and 5-90 wt % or 1-90 wt % glass component. The glass component includes 50-90 mole % SiO2, 5-35 mole % or 0.1-35 mole % B2O3, 0.1-10 mole % or 0.1-25 mole % Al2O3, 0.1-10 mole % K2O, 0.1-10 mole % Na2O, 0.1-20 mole % Li2O, 0.1-30 mole % F. The total amount of Li2O+Na2O+K2O is 0.1-30 mole % of the glass component. The silica powder can be amorphous or crystalline.Type: GrantFiled: November 5, 2018Date of Patent: February 18, 2020Assignee: Ferro CorporationInventors: Cody J. Gleason, John J. Maloney, Srinivasan Sridharan, George E. Sakoske, Peter Marley, Mohammed H. Megherhi, Yie-Shein Her, Orville W. Brown, Jackie D. Davis, Thomas J. Coffey, Ellen S. Tormey, Stanley Wang, David L. Widlewski
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Patent number: 10465295Abstract: A jettable etchant composition includes 1 to 90 wt % active ingredient, and a remainder containing any combination of the following: 10 to 90 wt % solvent, 0 to 10 wt % reducing agents, <1 to 20 wt % pickling agent, 0 to 5 wt % surfactant, and 0 to 5 wt % antifoam agent. The composition can also include a soluble compound containing at least one element which when dissolved has a higher standard electrode potential than a metal to be etched or a soluble compound containing a group IA element, and a soluble platinum group metal. An ink composition can include a group VA compound or a group IIIA compound in a solvent system formulated to be jettable on a surface at a drop volume of about 5 to about 10 picoliters and to achieve a final sheet resistance of less than about 20 ?/? of the surface upon activation.Type: GrantFiled: May 19, 2015Date of Patent: November 5, 2019Assignee: Alpha Assembly Solutions Inc.Inventors: Steven Prokopiak, Ellen S. Tormey, Oscar Khaselev, Michael T. Marczi, Bawa Singh
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Publication number: 20190135683Abstract: A low K value, high Q value, low firing dielectric material and method of forming a fired dielectric material. The dielectric material can be fired below 950° C. or below 1100° C., has a K value of less than about 8 at 10-30 GHz and a Q value of greater than 500 or greater than 1000 at 10-30 GHz. The dielectric material includes, before firing a solids portion including 10-95 wt % or 10-99 wt % silica powder and 5-90 wt % or 1-90 wt % glass component. The glass component includes 50-90 mole % SiO2, 5-35 mole % or 0.1-35 mole % B2O3, 0.1-10 mole % or 0.1-25 mole % Al2O3, 0.1-10 mole % K2O, 0.1-10 mole % Na2O, 0.1-20 mole % Li2O, 0.1-30 mole % F. The total amount of Li2O+Na2O+K2O is 0.1-30 mole % of the glass component. The silica powder can be amorphous or crystalline.Type: ApplicationFiled: November 5, 2018Publication date: May 9, 2019Inventors: Cody J. Gleason, John J. Maloney, Srinivasan Sridharan, George E. Sakoske, Peter Marley, Mohammed H. Megherhi, Yie-Shein Her, Orville W. Brown, Jackie D. Davis, Thomas J. Coffey, Ellen S. Tormey, Stanley Wang, David L. Widlewski
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Publication number: 20180036818Abstract: A thermal managing electrical connection tape includes a carrier film and a composition including solder powder, with the composition being applied to the carrier film. The composition includes a soldering flux having the solder powder disposed therein. The composition contains between about 50 wt % and about 70 wt % soldering flux. The composition further contains between about 30 wt % and about 50 wt % solder powder. A method of fabricating a thermal managing electrical connection tape includes providing a composition including at least one of a soldering flux and epoxy and/or acrylic, adding a solder powder to the composition, casting the composition on a carrier film, drying the carrier film in a drying furnace to form a dried tape, and cutting the dried tape to a desired width to form a thermal managing electrical connection tape.Type: ApplicationFiled: February 10, 2016Publication date: February 8, 2018Inventors: Steven Dane Prokopiak, Sanyogita Arora, Ranjit S. Pandher, Ellen S. Tormey, Bawa Singh
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Publication number: 20180020554Abstract: A method of assembling components, such as electronic components, onto a substrate, such as an electronic substrate, includes applying solder paste to an electronic substrate to form a solder paste deposit, placing a low temperature preform in the solder paste deposit, processing the electronic substrate at a reflow temperature of the solder paste to create a low temperature solder joint, and processing the low temperature solder joint at a reflow temperature that is lower than the reflow temperature of the solder paste. Other methods of assembling components and solder joint compositions are further disclosed.Type: ApplicationFiled: September 27, 2017Publication date: January 18, 2018Inventors: Paul Joseph Koep, Ellen S. Tormey, Girard Sidone
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Patent number: 9801285Abstract: A method of assembling components, such as electronic components, onto a substrate, such as an electronic substrate, includes applying solder paste to an electronic substrate to form a solder paste deposit, placing a low temperature preform in the solder paste deposit, processing the electronic substrate at a reflow temperature of the solder paste to create a low temperature solder joint, and processing the low temperature solder joint at a reflow temperature that is lower than the reflow temperature of the solder paste. Other methods of assembling components and solder joint compositions are further disclosed.Type: GrantFiled: March 15, 2013Date of Patent: October 24, 2017Inventors: Paul Joseph Koep, Ellen S. Tormey, Girard Sidone
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Publication number: 20170204523Abstract: A jettable etchant composition includes 1 to 90 wt % active ingredient, and a remainder containing any combination of the following: 10 to 90 wt % solvent, 0 to 10 wt % reducing agents, <1 to 20 wt % pickling agent, 0 to 5 wt % surfactant, and 0 to 5 wt % antifoam agent. The composition can also include a soluble compound containing at least one element which when dissolved has a higher standard electrode potential than a metal to be etched or a soluble compound containing a group IA element, and a soluble platinum group metal. An ink composition can include a group VA compound or a group IIIA compound in a solvent system formulated to be jettable on a surface at a drop volume of about 5 to about 10 picoliters and to achieve a final sheet resistance of less than about 20 ?/? of the surface upon activation.Type: ApplicationFiled: May 19, 2015Publication date: July 20, 2017Inventors: Steven PROKOPIAK, Ellen S. TORMEY, Oscar KHASELEV, Michael T. MARCZI, Bawa SINGH
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Publication number: 20150078810Abstract: A method of assembling components, such as electronic components, onto a substrate, such as an electronic substrate, includes applying solder paste to an electronic substrate to form a solder paste deposit, placing a low temperature preform in the solder paste deposit, processing the electronic substrate at a reflow temperature of the solder paste to create a low temperature solder joint, and processing the low temperature solder joint at a reflow temperature that is lower than the reflow temperature of the solder paste. Other methods of assembling components and solder joint compositions are further disclosed.Type: ApplicationFiled: March 15, 2013Publication date: March 19, 2015Inventors: Paul Joseph Koep, Ellen S. Tormey, Girard Sidone
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Publication number: 20140328039Abstract: In accordance with one or more aspects, a method of reducing void formation in a solder joint may comprise applying a solder paste deposit to a substrate, placing a solder preform in the solder paste deposit, disposing a device on the solder preform and the solder paste deposit, and processing the solder paste deposit and the solder preform to form the solder joint between the device and the substrate. In some aspects, the substrate is a printed circuit board and the device is an integrated circuit package.Type: ApplicationFiled: September 25, 2012Publication date: November 6, 2014Inventors: Paul J. Koep, Michiel A. de Monchy, Ellen S. Tormey
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Patent number: 8192047Abstract: The present invention relates to an LED lighting system producing light having improved Color Rendering Index (CRI). The system includes a plurality of LEDs wherein the LEDs have at least a first and second characteristic wavelength, and a mixed phosphor layer overlying at least one of a portion of the plurality of LEDs, the phosphor layer absorbing at least a portion of the LED-emitted light and producing phosphor-emitted light, wherein the phosphors includes a third characteristic wavelength and a fourth characteristic wavelength, wherein the third characteristic wavelength and fourth characteristic wavelength are not the same.Type: GrantFiled: February 15, 2008Date of Patent: June 5, 2012Assignee: Lighting Science Group CorporationInventors: Edward Bailey, Ellen S. Tormey
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Publication number: 20100118510Abstract: The present invention relates to an LED lighting system producing light having improved Color Rendering Index (CRI). The system includes a plurality of LEDs wherein the LEDs have at least a first and second characteristic wavelength, and a mixed phosphor layer overlying at least one of a portion of the plurality of LEDs, the phosphor layer absorbing at least a portion of the LED-emitted light and producing phosphor-emitted light, wherein the phosphors includes a third characteristic wavelength and a fourth characteristic wavelength, wherein the third characteristic wavelength and fourth characteristic wavelength are not the same.Type: ApplicationFiled: February 15, 2008Publication date: May 13, 2010Applicant: LIGHTING SCIENCE GROUP CORPORATIONInventors: Edward Bailey, Ellen S. Tormey
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Patent number: 6191934Abstract: High dielectric constant capacitors are made from a dielectric ink of lead-magnesium-niobate and lead oxide powders. Dielectric inks are made by mixing the dielectric powders with a suitable organic vehicle which can be used to coat one or more glass-based green tapes. Buried capacitors are made by coating an overlying and an underlying green tape with a conductor such as silver. Capacitors can also be made by adjusting the organic vehicle and forming a green tape from the dielectric powders. These dielectric green tapes each can be coated with a conductive layer and stacked, the conductive layers connected in parallel. The resultant multilayer capacitors have a very high dielectric constant, while eliminating the need for very large area capacitors, as compared to single layer capacitors.Type: GrantFiled: December 14, 1998Date of Patent: February 20, 2001Assignees: Sarnoff Corporation & Co., Ltd., Daewoo Electronics Co., Ltd.Inventors: Michael James Liberatore, Attiganal Narayanaswamy Sreeram, Ashok Narayan Prabhu, In-Tae Kim, Je-Do Mun, Sung-Dae Park, Yun-Hwi Park, Joo-Dong Yu, Ellen S. Tormey
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Patent number: 5514451Abstract: Conductive via fill inks for green tapes to be stacked and bonded to a support substrate, the glass used for the green tape having a firing temperature from 850.degree.-950.degree. C., wherein the glass used for the via fill ink has a glass transition temperature that is higher than that of the glass used to make the green tape, preferably does not crystallize at the maximum firing temperature of the green tape and comprises from 30-75 percent by volume of the glass-conductive metal powder mixture of the via fill ink. These conductive via fill inks will not shrink until the green tape shrinkage has commenced during firing of the composite circuit board and they will flow slightly during firing, forming good bonds to the glass in the walls of the vias, thereby ensuring good integrity of the vias and good connections to the circuitry on the fired ceramic multilayer circuit board.Type: GrantFiled: January 27, 1995Date of Patent: May 7, 1996Assignee: David Sarnoff Research Center, Inc.Inventors: Ananda H. Kumar, Barry J. Thaler, Ashok N. Prabhu, Ellen S. Tormey
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Patent number: 4769294Abstract: Substrates consisting of at least 98% narrow size distribution ceramic particles are co-sinterable with metallized paste to which selected compositions of glass have been added. Substrates produced in accordance with the present invention exhibit superior thermal conductivity, low shrinkage variability, and smoother and more homogeneous surface finish.Type: GrantFiled: November 26, 1986Date of Patent: September 6, 1988Assignee: Ceramics Process Systems Corp.Inventors: Eric A. Barringer, Roger S. Lind, Charles E. Swain, Ellen S. Tormey