Abstract: A multilayer ceramic circuit board comprises a core of high conductivity material such as metal and an overlying layer of electrically insulating ceramic having an outer surface. In accordance with the invention, a circuit board for receiving a high power component is provided with a thermal spreading layer on or near the outer surface and one or more thermal vias through the ceramic to thermally couple the spreading layer to the core. The vias and the spreading layer comprise electrically insulating thermally conductive materials. The resulting structure provides rapid heat dissipation for a high power component formed or mounted on or near the spreading layer.

Abstract: A multilayer ceramic circuit board comprises a core of high conductivity material such as metal and an overlying layer of electrically insulating ceramic having an outer surface. In accordance with the invention, a circuit board for receiving a high power component is provided with a thermal spreading layer on or near the outer surface and one or more thermal vias through the ceramic to thermally couple the spreading layer to the core. The vias and the spreading layer comprise electrically insulating thermally conductive materials. The resulting structure provides rapid heat dissipation for a high power component formed or mounted on or near the spreading layer.

Abstract: A package for an electronic component includes a metal support substrate having a pattern of openings therethrough and a body of an insulating material, such as glass or ceramic, on and bonded to the surface of the support substrate. The body is formed from a plurality of layers of an insulating material, and conductive vias extending through the plurality of layers to the support substrate; said insulating body having an opening therein, an electronic component directly mounted in said opening to the patterned base plate. The base plate can be cut into one or more modules and directly soldered to a motherboard having additional devices mounted thereon.

Abstract: Integrated packages incorporating multilayer ceramic circuit boards mounted on a metal support substrate can be used for temperature control by the metal support substrate. Various electronic components, as well as additional temperature control devices, can be connected to the circuit boards and to the metal support substrate to control or regulate the temperature of operation of the components. The integrated package can be hermetically sealed with a lid.

Abstract: Materials for making a plasma display having a transparent front panel spaced from a back panel which is a metal core having layers of a dielectric material extending over and bonded to the core. The materials of which the back panel is made are chosen to form a back panel having a thermal coefficient of expansion compatible with that of the front panel. The dielectric material is made from a green ceramic tape which is bonded to the core and cofired with the core to form the back panel. The materials for the dielectric can be chosen such that the composite TCE of the cofired assembly matches the TCE of the front panel.

Abstract: A package for an electronic component includes a metal support substrate having a pattern of openings therethrough and a body of an insulating material, such as glass or ceramic, on and bonded to the surface of the support substrate. The body is formed from a plurality of layers of an insulating material, and conductive vias extending through the plurality of layers to the support substrate; said insulating body having an opening therein, an electronic component directly mounted in said opening to the patterned base plate. The base plate can be cut into one or more modules and directly soldered to a motherboard having additional devices mounted thereon.

Abstract: Integrated packages incorporating multilayer ceramic circuit boards mounted on a metal support substrate can be used for temperature control by the metal support substrate. Various electronic components, as well as additional temperature control devices, can be connected to the circuit boards and to the metal support substrate to control or regulate the temperature of operation of the components. The integrated package can be hermetically sealed with a lid.

Abstract: A package for an electronic component includes a metal support substrate having a pattern of openings therethrough and a body of an insulating material, such as glass or ceramic, on and bonded to the surface of the support substrate. The body is formed from a plurality of layers of an insulating material, and conductive vias extending through the plurality of layers to the support substrate; said insulating body having an opening therein, an electronic component directly mounted in said opening to the patterned base plate. The base plate can be cut into one or more modules and directly soldered to a motherboard having additional devices mounted thereon.

Abstract: A package for an electronic component includes a metal support substrate having a pattern of openings therethrough and a body of an insulating material, such as glass or ceramic, on and bonded to the surface of the support substrate. The body is formed from a plurality of layers of an insulating material, and conductive vias extending through the plurality of layers to the support substrate; said insulating body having an opening therein, an electronic component directly mounted in said opening to the patterned base plate. The base plate can be cut into one or more modules and directly soldered to a motherboard having additional devices mounted thereon.

Abstract: Integrated packages incorporating multilayer ceramic circuit boards mounted on a metal support substrate can be used for temperature control by the metal support substrate. Various electronic components, as well as additional temperature control devices, can be connected to the circuit boards and to the metal support substrate to control or regulate the temperature of operation of the components. The integrated package can be hermetically sealed with a lid.

Abstract: Resistors can be screen printed onto a green tape stack from a resistor ink comprising ruthenium oxide and a sufficient amount of a low melting temperature glass so that the resultant mixture fires at a temperature of 850-900° C. A conductive layer, as of silver, terminates the screen printed resistor layer and one or two green tapes are applied over the resistor layer to embed the resistors during firing. A final conductive layer is applied after firing.

Abstract: Materials for making a plasma display having a transparent front panel spaced from a back panel which is a metal core having layers of a dielectric material extending over and bonded to the core. The materials of which the back panel is made are chosen to form a back panel having a thermal coefficient of expansion compatible with that of the front panel. The dielectric material is made from a green ceramic tape which is bonded to the core and cofired with the core to form the back panel. The materials for the dielectric can be chosen such that the composite TCE of the cofired assembly matches the TCE of the front panel.

Abstract: Embedded passive components such as capacitors are formed in multilayer ceramic circuit boards by screen printing a component precursor compound ink sandwiched between conductor ink layers onto a green tape stack and covering the component ink layer with one or two green tape layers, aligning and laminating the green tapes and firing. Capacitor inks are made from dielectrics chosen from barium titanate, titanium oxide and lead-magnesium-niobate. The green tapes are made of a mixture of a crystallizing glass, a non-crystallizing glass and an oxide filler which does not shrink in the x and y dimensions during firing mounted on a metal support. Thus the embedded components can be made to close tolerances.

Abstract: High magnesium-content magnesium aluminosilicate glasses are used to form green tape compositions that are fired stepwise, i.e., first to about 500.degree. C. to remove organic materials, then to a temperature 10-30.degree. C. above the glass transition temperature for a time sufficient to nucleate the glass, and finally to a higher temperature near but below the softening temperature to complete crystallization of the glass. The resultant glass-ceramic may include substantial amounts of the forsterite crystalline phase. Multilayer ceramic printed circuit boards are made that are useful for high frequency, microwave applications. The fired high magnesium oxide content glasses have low dielectric constant and low dissipation loss factors, and they have a thermal coefficient of expansion that is compatible with metal or ceramic support substrates that impart mechanical strength to the printed circuit boards and that are thermally conductive. The boards are compatible with gallium arsenide devices.

Abstract: High magnesium-content magnesium aluminosilicate glasses are used to form green tape compositions that are fired stepwise, i.e., first to about 500.degree. C. to remove organic materials, then to a temperature 10-30.degree. C. above the glass transition temperature for a time sufficient to nucleate the glass, and finally to a higher temperature near but below the softening temperature to complete crystallization of the glass. The resultant glass-ceramic may include substantial amounts of the forsterite crystalline phase. Multilayer ceramic printed circuit boards are made that are useful for high frequency, microwave applications. The fired high magnesium oxide content glasses have low dielectric constant and low dissipation loss factors, and they have a thermal coefficient of expansion that is compatible with metal or ceramic support substrates that impart mechanical strength to the printed circuit boards and that are thermally conductive. The boards are compatible with gallium arsenide devices.

Abstract: Embedded capacitors are formed in multilayer ceramic circuit boards by screen printing a capacitor ink sandwiched between conductor ink layers onto a green tape stack and covering the ink layer with one or two green tapes, and aligning the green tape layers, and firing. The green tapes are made of a mixture of a crystallizing glass, a non-crystallizing glass and an oxide filler which do not shrink in the x and y dimensions during firing. Thus the capacitors can be made to close tolerances.

Abstract: An electronic integrated circuit which includes at least one of RF, microwave, digital and analog components connected in a desired circuit. The integrated circuit includes a substrate of a conductive material having on a surface thereof a body of a dielectric material. The dielectric body is formed of a plurality of layers of the dielectric material bonded together. A plurality of strips of a conductive material are on the surfaces of the layers of the body to form RF, analog and digital components. Discrete electronic devices are mounted on the body and connected in the circuit. Vias of a conductive material extend through the various layers of the body to electrically connect the various strips of conductive material on the layers of the body.

Abstract: Multilayer green tape stacks having sufficient layers so that the fired stack is at least 2 millimeters in thickness on a metal support substrate are made by interleaving two types of green tapes comprising a low dielectric loss glass of a first type including at least 5% of an oxide filler and a green tape of a second type comprising a low dielectric loss glass and a higher amount of an oxide filler than the green tape of the first type, on a metal support substrate. These fired green tape stacks shrink on firing only in the thickness dimension.

Abstract: A ceramic mixture of a crystallizable ZnO--MgO--B.sub.2 O.sub.3 --SiO.sub.2 glass mixed with a non-crystallizing lead-based glass and one or more oxide fillers forms a fired ceramic that has a TCE compatible with that of kovar. Green tapes made from the ceramic mixture aligned with a kovar support substrate when fired have excellent dielectric and low loss properties.