Patents by Inventor Ellice Y. Luh

Ellice Y. Luh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Via metallization for AlN ceramic electronic package
    Patent number: 5200249
    Abstract: Metallization formulations containing a mixture of AlN and metal are used to form hermetic vias in AlN dielectric bases for electronic packaging. The metal may be W, Mo, or mixtures thereof. The metallization may be cofired with the AlN dielectric base. The metallization is especially useful for making electrically conductive hermetic through-vias in AlN bases.
    Type: Grant
    Filed: August 22, 1991
    Date of Patent: April 6, 1993
    Assignee: W. R. Grace & Co.-Conn.
    Inventors: Leonard E. Dolhert, Jack H. Enloe, Ellice Y. Luh, John W. Lau