Abstract: A carrier card for reduced width circuit card assemblies are described. The carrier card includes a U-shaped design. A daughter card mounts in a void in the carrier card in a co-planar fashion. The carrier card includes an upper member; a lateral member, a lower member and a front panel with optional snout. The lateral member or other member includes a carrier card electrical and/or optical connector. The lower member or other member includes a mating electrical and/or optical connector to connect with the daughter card. The upper member, the lateral member, and the lower member form or define the void. A front panel connects with the upper and lower member and, optionally, the daughter card to provide structural integrity and provides additional I/O for the assembly.

Abstract: A high current solid-state bidirectional relay assembly includes a first conductor bar, a second conductor bar, and a third intermediate conductor bar. A plurality of MOSFET switching elements are disposed in two back-to-back arrays of switching elements. Either all of the source leads or all of the drain leads of the plurality of MOSFET switching element are electrically connected to the third intermediate conductor bar. The other leads of each MOSFET switching element in one of the arrays are electrically connected to the first conductor bar, and the other leads of each MOSFET switching element in the other array are electrically connected to the second conductor bar. A printed circuit board has control circuitry to control the bidirectional relay. All of the gate leads of the plurality of MOSFET switching elements are electrically connected to the control circuitry of the printed circuit board.