Patents by Inventor Elliott Simons

Elliott Simons has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • 3D chip package with shielded structures
    Patent number: 8686543
    Abstract: A 3D chip package is disclosed that includes a carrier substrate with a first cavity and a second cavity formed therein. A first structure is attached to the carrier substrate at least partially in the first cavity, and a second structure is attached to the carrier substrate at least partially in the second cavity, where the first and second structures include electrical circuitry. A shield layer may be disposed between the carrier substrate and the first structure and/or the second structure for isolating the first structure and/or the second structure at least one of electrically, magnetically, optically, or thermally. In some embodiments, the shield layer may be a dielectric shield layer for dielectrically coupling the first structure and the second structure. The first structure and the second structure may be homogeneous or heterogeneous.
    Type: Grant
    Filed: October 28, 2011
    Date of Patent: April 1, 2014
    Assignee: Maxim Integrated Products, Inc.
    Inventors: Albert Bergemont, Uppili Sridhar, Joseph Ellul, Yi-Sheng Anthony Sun, Elliott Simons
  • 3D CHIP PACKAGE WITH SHIELDED STRUCTURES
    Publication number: 20130105950
    Abstract: A 3D chip package is disclosed that includes a carrier substrate with a first cavity and a second cavity formed therein. A first structure is attached to the carrier substrate at least partially in the first cavity, and a second structure is attached to the carrier substrate at least partially in the second cavity, where the first and second structures include electrical circuitry. A shield layer may be disposed between the carrier substrate and the first structure and/or the second structure for isolating the first structure and/or the second structure at least one of electrically, magnetically, optically, or thermally. In some embodiments, the shield layer may be a dielectric shield layer for dielectrically coupling the first structure and the second structure. The first structure and the second structure may be homogeneous or heterogeneous.
    Type: Application
    Filed: October 28, 2011
    Publication date: May 2, 2013
    Applicant: Maxim Integrated Products, Inc.
    Inventors: Albert Bergemont, Uppili Sridhar, Joseph Ellul, Yi-Sheng Anthony Sun, Elliott Simons