Abstract: A method of making replicas of a master stamping die having a master die pattern in relief comprises first making a negative mold of the master stamping die. The mold has a negative mold cavity pattern corresponding to said master die pattern. One or more layers of die forming material is electrodeposited on the negative mold to create a replical die electroform having a cavity pattern like the mold cavity pattern. A thin electrically insulative shield is formed which has a opening pattern having generally the outline of the electroform cavity pattern. The shield is laminated on the replica die electroform with the opening pattern aligned with the electroform cavity pattern. A die material is electrodeposited into the electroform cavity pattern through the opening pattern in the shield to fill the electroform cavity pattern.