Abstract: A multiple wafer cleaning apparatus comprising a first module (12), having a first spaced-apart brush assembly having an inner brush (21a) and an outer brush (22a), each brush having a brush pad (102) and a platen (103), and a second module (14) having a second spaced-apart brush assembly (22) having an inner brush (22a) and an outer brush (22b), each brush having a brush pad (102) and a platen (103), each pair of spaced-apart, opposing, vertically disposed brushes (21) and (22) for scrubbing vertically disposed semiconductor wafers (25), in tanks (28). The two modularized sets of motorized, rotating, opposed, pancake shaped brushes (12) and (14), grip the freely rotating wafers (25) causing the wafers (25) to rotate in the same direction as the brushes.

Abstract: An apparatus and method for cleaning of disc-shaped objects, such as semiconductor wafers, employing a rotational fluid track. The cleaning may take place in a vertical cleaning chamber or optionally a horizontal cleaning chamber. Rotation of wafers is obtained without direct contact by motorized driver rollers that may have the potential of damaging the wafer. In preferred embodiments of the invention, a viscous shearing force is tangentially directed upon the surface of a wafer as the wafer rests upon support rollers within a cleaning chamber. Pressurized cleaning solutions are directed toward the wafer surface at an angle sufficient to impart a rotational force upon the wafer. In one embodiment of the invention, as the wafer spins within the cleaning chamber, a megasonic cleaning transducer is employed to enhance the surface cleaning process.

Abstract: A multiple wafer cleaning apparatus comprising a first module (12), having a first spaced-apart brush assembly having an inner brush (21a) and an outer brush (22a), each brush having a brush pad (102) and a platen (103), and a second module (14) having a second spaced-apart brush assembly (22) having an inner brush (22a) and an outer brush (22b), each brush having a brush pad (102) and a platen (103), each pair of spaced-apart, opposing, vertically disposed brushes (21) and (22) for scrubbing vertically disposed semiconductor wafers (25), in tanks (28). The two modularized sets of motorized, rotating, opposed, pancake shaped brushes (12) and (14), grip the freely rotating wafers (25) causing the wafers (25) to rotate in the same direction as the brushes.

Abstract: The cleaning pads (102, 104) that are used to clean work pieces (200), such as semiconductor wafers, are cyclically compressed against one another and rinsed with a rinsing fluid. By cyclically compressing the cleaning pads (102, 104) together and rinsing them, the debris that the cleaning pads remove from the work pieces (200) and that becomes embedded in, and adhered to, the cleaning pads (102, 104) is subsequently removed therefrom.