Patents by Inventor Elmer Dimaculangan Perez
Elmer Dimaculangan Perez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11701883Abstract: An electronic assembly includes a substrate having a die and PCB mounted thereon. Wirebonds interconnect bond pads of the die with contact pads of the PCB, each wirebond having a first end portion bonded to a respective bond pad, an opposite second end portion bonded to a respective contact pad and an intermediate section extending between the first and second end portions. A dam encapsulant encapsulates each of the first and second end portions, a first fill encapsulant contacts the substrate and the dam encapsulant; and a second fill encapsulant overlies the first fill encapsulant. The first fill encapsulant has a lower modulus of elasticity than the second fill encapsulant and the dam encapsulant.Type: GrantFiled: August 11, 2021Date of Patent: July 18, 2023Assignee: Memjet Technology LimitedInventors: Elmer Dimaculangan Perez, See-Huat Tan, Glenn Horrocks, Mohammad Hossain, Michael John Webb, Pascal Blanquer, Erik Coolen
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Publication number: 20220048289Abstract: An electronic assembly includes a substrate having a die and PCB mounted thereon. Wirebonds interconnect bond pads of the die with contact pads of the PCB, each wirebond having a first end portion bonded to a respective bond pad, an opposite second end portion bonded to a respective contact pad and an intermediate section extending between the first and second end portions. A dam encapsulant encapsulates each of the first and second end portions, a first fill encapsulant contacts the substrate and the dam encapsulant; and a second fill encapsulant overlies the first fill encapsulant. The first fill encapsulant has a lower modulus of elasticity than the second fill encapsulant and the dam encapsulant.Type: ApplicationFiled: August 11, 2021Publication date: February 17, 2022Inventors: Elmer Dimaculangan PEREZ, See-Huat TAN, Glenn HORROCKS, Mohammad HOSSAIN, Michael John WEBB, Pascal BLANQUER, Erik COOLEN
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Publication number: 20210061467Abstract: A MEMS chip assembly includes: a support structure having a chip mounting surface; a MEMS chip mounted on the chip mounting surface, the MEMS chip having an active surface including one or more rows of MEMS devices and a row of bond pads disposed alongside a connection edge of the MEMS chip and parallel with the rows of MEMS devices; electrical connectors connected to the bond pads; and an encapsulant material covering the electrical connectors. The MEMS chip has a plurality of trenches defined in the active surface, the trenches extending parallel with the rows of MEMS devices and disposed between the bond pads and the MEMS devices. The encapsulant material does not encroach past the trenches towards the MEMS devices.Type: ApplicationFiled: November 12, 2020Publication date: March 4, 2021Inventors: Elmer Dimaculangan Perez, Angus North, Graeme Lowe, See-Huat Tan, Christopher Barton
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Patent number: 10870278Abstract: An inkjet printhead includes: a support structure having a plurality of printhead chips mounted thereto; and a shield plate bonded to the support structure, the shield plate having a slot aligned with the printhead chips, the slot having a perimeter edge. A sealant is disposed on all exposed portions of the support structure adjacent the perimeter edge of each slot.Type: GrantFiled: July 2, 2019Date of Patent: December 22, 2020Inventors: Elmer Dimaculangan Perez, Nicholas Chin, Miao Wang, See-Huat Tan, Jason Thelander, David Burke, Andrew Thomas, Mahes Rajaratnam
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Patent number: 10864733Abstract: A MEMS chip assembly including: a support structure having a chip mounting surface; a MEMS chip mounted on the chip mounting surface, each MEMS chip having an active surface including one or more MEMS devices and a plurality of bond pads disposed alongside a connection edge of the MEMS chip; electrical connectors connected to the bond pads; and an encapsulant material covering the electrical connectors. The MEMS chip has encapsulant-retaining trenches defined in the active surface extending alongside the connection edge, each encapsulant-retaining trench being disposed between the bond pads and the MEMS devices.Type: GrantFiled: May 1, 2019Date of Patent: December 15, 2020Inventors: Elmer Dimaculangan Perez, Angus North, Graeme Lowe, See-Huat Tan, Christopher Barton
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Patent number: 10850517Abstract: An inkjet printhead includes: an elongate support having a printhead mounting surface; a plurality of butting printhead chips mounted on the printhead mounting surface, each printhead chip having an ink ejection surface including one or more nozzle rows; and a grout material disposed between butting edges of each butting pair of printhead chips. Each printhead chip has a grouting trench defined in the ink ejection surface, the grouting trench extending alongside at least one butting edge and the grouting trench being disposed between an endmost nozzle of each nozzle row and the butting edge.Type: GrantFiled: May 1, 2019Date of Patent: December 1, 2020Inventors: Elmer Dimaculangan Perez, Angus North, Graeme Lowe, See-Huat Tan, Christopher Barton
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Publication number: 20190337292Abstract: An inkjet printhead includes: an elongate support having a printhead mounting surface; a plurality of butting printhead chips mounted on the printhead mounting surface, each printhead chip having an ink ejection surface including one or more nozzle rows; and a grout material disposed between butting edges of each butting pair of printhead chips. Each printhead chip has a grouting trench defined in the ink ejection surface, the grouting trench extending alongside at least one butting edge and the grouting trench being disposed between an endmost nozzle of each nozzle row and the butting edge.Type: ApplicationFiled: May 1, 2019Publication date: November 7, 2019Inventors: Elmer Dimaculangan Perez, Angus North, Graeme Lowe, See-Huat Tan, Christopher Barton
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Publication number: 20190337291Abstract: A MEMS chip assembly including: a support structure having a chip mounting surface; a MEMS chip mounted on the chip mounting surface, each MEMS chip having an active surface including one or more MEMS devices and a plurality of bond pads disposed alongside a connection edge of the MEMS chip; electrical connectors connected to the bond pads; and an encapsulant material covering the electrical connectors. The MEMS chip has encapsulant-retaining trenches defined in the active surface extending alongside the connection edge, each encapsulant-retaining trench being disposed between the bond pads and the MEMS devices.Type: ApplicationFiled: May 1, 2019Publication date: November 7, 2019Inventors: Elmer Dimaculangan Perez, Angus North, Graeme Lowe, See-Huat Tan, Christopher Barton
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Publication number: 20190322103Abstract: An inkjet printhead includes: a support structure having a plurality of printhead chips mounted thereto; and a shield plate bonded to the support structure, the shield plate having a slot aligned with the printhead chips, the slot having a perimeter edge. A sealant is disposed on all exposed portions of the support structure adjacent the perimeter edge of each slot.Type: ApplicationFiled: July 2, 2019Publication date: October 24, 2019Inventors: Elmer Dimaculangan Perez, Nicholas Chin, Miao Wang, See-Huat Tan, Jason Thelander, David Burke, Andrew Thomas, Mahes Rajaratnam
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Patent number: 8322207Abstract: A tack adhesion testing device for quantitatively measuring tack adhesion between a material and an object with a planar surface for contact with the material. The device has a material mount for mounting a quantity of the material such that the quantity of material presents an exposed flat face, an object mount for securely holding the object such that the planar surface is in flat contact with the exposed flat surface, the material mount and the object mount being movable relative to each other, a contact force applicator for applying a known force urging the exposed flat face and the planar surface into contact and, separation mechanism for applying a variable force to the material mount and the object mount to slide the flat face and the planar surface relative to each other such that the variable force can be increased until the flat face and the planar surface slide relative to each other.Type: GrantFiled: February 3, 2009Date of Patent: December 4, 2012Assignee: Silverbrook Research Pty LtdInventors: Nadine Lee-Yen Chew, Elmer Dimaculangan Perez
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Patent number: 8017450Abstract: A method of forming an asymmetrical encapsulant bead on a series of wire bonds electrically connecting a micro-electronic device to a series of conductors, the micro-electronic device having a planar active surface. The method has the steps of positioning the die and the wire bonds beneath an encapsulant jetter that jets drops of encapsulant on to the wire bonds, the drops of encapsulant following a vertical trajectory, tilting the die such that the active surface is inclined to the horizontal and, jetting the drops of encapsulant to form a bead of encapsulant material covering the series of wire bonds, the bead having a cross sectional profile that is asymmetrical about an axis parallel to a normal to the active surface.Type: GrantFiled: February 3, 2009Date of Patent: September 13, 2011Assignee: Silverbrook Research Pty LtdInventors: Nadine Lee-Yen Chew, Elmer Dimaculangan Perez, Kiangkai Tankongchumruskul
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Patent number: 7915091Abstract: A method of jetting drops of encapsulant from an encapsulant jetter, the drops including primary drops and satellite drops that are much smaller than the primary drops. The method has the steps of providing a series of wire bonds electrically connecting a micro-electronic device to a series of conductors, jetting the drops of encapsulant from the jetter and, inducing a gas flow with a velocity sufficient to draw the satellite drops in a predetermined direction away from the series of wire bonds while having negligible effect on the primary drops.Type: GrantFiled: February 3, 2009Date of Patent: March 29, 2011Assignee: Silverbrook Research Pty LtdInventors: Nadine Lee-Yen Chew, Elmer Dimaculangan Perez, Kiangkai Tankongchumruskul
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Publication number: 20100072473Abstract: A tack adhesion testing device for quantitatively measuring tack adhesion between a material and an object with a planar surface for contact with the material. The device has a material mount for mounting a quantity of the material such that the quantity of material presents an exposed flat face, an object mount for securely holding the object such that the planar surface is in flat contact with the exposed flat surface, the material mount and the object mount being movable relative to each other, a contact force applicator for applying a known force urging the exposed flat face and the planar surface into contact and, separation mechanism for applying a variable force to the material mount and the object mount to slide the flat face and the planar surface relative to each other such that the variable force can be increased until the flat face and the planar surface slide relative to each other.Type: ApplicationFiled: February 3, 2009Publication date: March 25, 2010Inventors: Nadine Lee-Yen Chew, Elmer Dimaculangan Perez
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Publication number: 20100075466Abstract: A method of forming an asymmetrical encapsulant bead on a series of wire bonds electrically connecting a micro-electronic device to a series of conductors, the micro-electronic device having a planar active surface. The method has the steps of positioning the die and the wire bonds beneath an encapsulant jetter that jets drops of encapsulant on to the wire bonds, the drops of encapsulant following a vertical trajectory, tilting the die such that the active surface is inclined to the horizontal and, jetting the drops of encapsulant to form a bead of encapsulant material covering the series of wire bonds, the bead having a cross sectional profile that is asymmetrical about an axis parallel to a normal to the active surface.Type: ApplicationFiled: February 3, 2009Publication date: March 25, 2010Inventors: Nadine Lee-Yen Chew, Elmer Dimaculangan Perez, Kiangkai Tankongchumruskul
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Publication number: 20100075025Abstract: A method of jetting drops of encapsulant from an encapsulant jetter, the drops including primary drops and satellite drops that are much smaller than the primary drops. The method has the steps of providing a series of wire bonds electrically connecting a micro-electronic device to a series of conductors, jetting the drops of encapsulant from the jetter and, inducing a gas flow with a velocity sufficient to draw the satellite drops in a predetermined direction away from the series of wire bonds while having negligible effect on the primary drops.Type: ApplicationFiled: February 3, 2009Publication date: March 25, 2010Inventors: Nadine Lee-Yen Chew, Elmer Dimaculangan Perez, Kiangkai Tankongchumruskul
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Publication number: 20100075465Abstract: A method of reducing voids within a bead of encapsulant material deposited on a series of wire bonds connecting a micro-electronic device with die contact pads extending along one edge, and a plurality of conductors on a support structure such that the wire bonds extend across a gap defined between the edge of the micro-electronic device and the plurality of conductors. The method has the steps of depositing at least one transverse bead of encapsulant in the gap extending at an angle to the edge of the micro-electronic device, and, depositing at least one longitudinal bead of encapsulant in the gap extending parallel to the edge of the micro-electronic device.Type: ApplicationFiled: February 3, 2009Publication date: March 25, 2010Inventors: Nadine Lee-Yen Chew, Elmer Dimaculangan Perez, Kiangkai Tankongchumruskul
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Publication number: 20100075446Abstract: A method of forming an asymmetrical encapsulant bead on a series of wire bonds electrically connecting a micro-electronic device to a series of conductors, the micro-electronic device having a planar active surface. The method has the steps of positioning the die and the wire bonds beneath an encapsulant jetter that jets drops of encapsulant on to the wire bonds, the drops of encapsulant following a vertical trajectory, tilting the die such that the active surface is inclined to the horizontal and, jetting the drops of encapsulant to form a bead of encapsulant material covering the series of wire bonds, the bead having a cross sectional profile that is asymmetrical about an axis parallel to a normal to the active surface.Type: ApplicationFiled: September 25, 2008Publication date: March 25, 2010Inventors: Nadine Lee-Yen Chew, Elmer Dimaculangan Perez, Kiangkai Tankongchumruskul
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Publication number: 20100071456Abstract: A tack adhesion testing device for quantitatively measuring tack adhesion between a material and an object with a planar surface for contact with the material. The device has a material mount for mounting a quantity of the material such that the quantity of material presents an exposed flat face, an object mount for securely holding the object such that the planar surface is in flat contact with the exposed flat surface, the material mount and the object mount being movable relative to each other, a contact force applicator for applying a known force urging the exposed flat face and the planar surface into contact and, separation mechanism for applying a variable force to the material mount and the object mount to slide the flat face and the planar surface relative to each other such that the variable force can be increased until the flat face and the planar surface slide relative to each other.Type: ApplicationFiled: September 25, 2008Publication date: March 25, 2010Inventors: Nadine Lee-Yen Chew, Elmer Dimaculangan Perez
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Publication number: 20100075464Abstract: A method of reducing voids within a bead of encapsulant material deposited on a series of wire bonds connecting a micro-electronic device with die contact pads extending along one edge, and a plurality of conductors on a support structure such that the wire bonds extend across a gap defined between the edge of the micro-electronic device and the plurality of conductors. The method has the steps of depositing at least one transverse bead of encapsulant in the gap extending at an angle to the edge of the micro-electronic device, and, depositing at least one longitudinal bead of encapsulant in the gap extending parallel to the edge of the micro-electronic device.Type: ApplicationFiled: September 25, 2008Publication date: March 25, 2010Inventors: Nadine Lee-Yen Chew, Elmer Dimaculangan Perez, Kiangkai Tankongchumruskul