Patents by Inventor Elmer Mahia

Elmer Mahia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8715777
    Abstract: In a method in which a cut line is formed on one surface of a planar glass material, and the cut line is allowed to extend in the thickness direction of the glass material, thereby cutting a glass substrate from the glass material, the cut line is selectively formed on a surface having relatively small surface waviness out of two opposing surfaces of the glass material. In the case of a glass material formed into a planar shape on a molten metal, the surface which has come into contact with the molten metal is selected as the surface having relatively small surface waviness. When a disk-shaped glass substrate is cut from the glass material, cutting is performed under conditions where either one of the thickness and the radius of the glass material and the maximum height of surface waviness of the glass material satisfy a predetermined relationship.
    Type: Grant
    Filed: April 30, 2012
    Date of Patent: May 6, 2014
    Assignee: Hoya Corporation
    Inventors: Joseph Marquez, Elmer Mahia
  • Patent number: 8383196
    Abstract: In a method in which a cut line is formed on one surface of a planar glass material, and the cut line is allowed to extend in the thickness direction of the glass material, thereby cutting a glass substrate from the glass material, the cut line is selectively formed on a surface having relatively small surface waviness out of two opposing surfaces of the glass material. In the case of a glass material formed into a planar shape on a molten metal, the surface which has come into contact with the molten metal is selected as the surface having relatively small surface waviness. When a disk-shaped glass substrate is cut from the glass material, cutting is performed under conditions where either one of the thickness and the radius of the glass material and the maximum height of surface waviness of the glass material satisfy a predetermined relationship.
    Type: Grant
    Filed: March 23, 2007
    Date of Patent: February 26, 2013
    Assignees: Hoya Corporation, Hoya Glass Disk Philippines, Inc.
    Inventors: Joseph Marquez, Elmer Mahia
  • Publication number: 20120213921
    Abstract: In a method in which a cut line is formed on one surface of a planar glass material, and the cut line is allowed to extend in the thickness direction of the glass material, thereby cutting a glass substrate from the glass material, the cut line is selectively formed on a surface having relatively small surface waviness out of two opposing surfaces of the glass material. In the case of a glass material formed into a planar shape on a molten metal, the surface which has come into contact with the molten metal is selected as the surface having relatively small surface waviness. When a disk-shaped glass substrate is cut from the glass material, cutting is performed under conditions where either one of the thickness and the radius of the glass material and the maximum height of surface waviness of the glass material satisfy a predetermined relationship.
    Type: Application
    Filed: April 30, 2012
    Publication date: August 23, 2012
    Applicants: HOYA GLASS DISK PHILIPPINES, INC., HOYA CORPORATION
    Inventors: JOSEPH MARQUEZ, Elmer Mahia
  • Publication number: 20090136659
    Abstract: In a method in which a cut line is formed on one surface of a planar glass material, and the cut line is allowed to extend in the thickness direction of the glass material, thereby cutting a glass substrate from the glass material, the cut line is selectively formed on a surface having relatively small surface waviness out of two opposing surfaces of the glass material. In the case of a glass material formed into a planar shape on a molten metal, the surface which has come into contact with the molten metal is selected as the surface having relatively small surface waviness. When a disk-shaped glass substrate is cut from the glass material, cutting is performed under conditions where either one of the thickness and the radius of the glass material and the maximum height of surface waviness of the glass material satisfy a predetermined relationship.
    Type: Application
    Filed: March 23, 2007
    Publication date: May 28, 2009
    Applicants: HOYA CORPORATION, HOYA GLASS DISK PHILIPPINES, INC.
    Inventors: Joseph Marquez, Elmer Mahia