Abstract: A thermoconductive module to control the temperature of a DUT including a top surface having an area and a topography comprising, in combination, a heat exchange surface for interfacing and engaging with the top surface of the DUT, a plurality of individually moveable elements arranged throughout the area of the top surface of the DUT for moving the heat exchange surface to contour the heat exchange surface to map the topography of the top surface of the DUT and means in thermal communication with the heat exchange surface for producing the heat transfer between the top surface of the DUT and the heat exchange surface.

Abstract: A handling system for devices under test (DUTs), i.e. semiconductor chips. A rotatable platform is provided which platform has a plurality of boats or nests. The DUTs are inserted in the boats. The platform carrying the DUTs is indexed through a plurality of treatment stations to precondition the chips specifically to bring the chip to a test temperature. At a test station, the chip is removed from the boat and inserted into a manufacturer's test head. The chip is tested, returned to the boat and indexed to a treatment station(s) downstream of the test head where is ultimately removed for further processing.

Abstract: A temperature controller to accurately control the temperature of a device under test (DUT) including a heat exchanger in heat exchange relationship with the DUT. A temperature sensor is received within the heat exchanger and is thermally isolated therefrom. This temperature sensor measures the temperature of the DUT. A second temperature sensor is received within the heat exchanger and measures the temperature of the heat exchanger. The temperature of the DUT is based on temperature readings from both of the sensors.

Abstract: A temperature controller to accurately control the temperature of a device under test (DUT) a heat exchanger in heat exchange relationship with the DUT. A temperature sensor is received within the heat exchange device and thermally isolated therefrom. This temperature sensor measures the temperature of the DUT. A second temperature sensor is received within the heat exchange device and measures the temperature of the heat exchange device. The temperature of the DUT is based on temperature readings from both the sensors.

Abstract: An electronic component burn-in thermal control system which accurately and independently controls device case temperature with close-loop conductive heating is provided. A heat exchange device adapted to be placed in heat transfer relationship with the electronic component has a temperature profile different from that of the electronic component.

Abstract: A burn-in tower having a skeletal frame which defines an outer wall is rotatably secured to a fixed base. A plurality of DUT positions are provided on the surface of the tower. Each DUT position comprises a thermal conductive module and a DUT socket assembly which are releasably engaged on to the other. The temperature of the DUT at each DUT position is controlled independently. The load applied to the DUT at each position may be the same or different. The tower is used at ambient temperatures. In a preferred embodiment, DUT mother boards which contain the driver electronics define the surface or walls of the tower.

Abstract: A socket adapted to receive an integrated circuit having a body with outer opposed walls, having upper edges and a plurality of substantially flat contacts biased to a closed position within the socket body. The leads of the integrated circuit to be tested engage the contacts. The contacts extend over the upper edge of the walls and are then turned downwardly to form a neck portion of reduced width compared to the width of the contact disposed within the socket 40.

Abstract: Nestable burn-in trays for semiconductor circuits are provided. The trays are stackable thereby eliminating the need for special storage cabinets. Further the trays are designed not to tilt when being inserted or removed from a burn-in chamber preventing damage to the components on the tray.