Abstract: A misalignment compensating optical sensor (222), that is operable to receive excitation light (30) having a range of input propagation angles ?. The sensor (222) has a variable reflected propagation angle ?0i reflective surface (227) and a sensing waveguide (228). The shape of the reflective surface (227) is selected to maximize the amount of the excitation light (30) it reflects into the sensing waveguide (227) despite misalignment errors between the sensor (222) and the source (58) of excitation light (30). The sensor may also have a lens portion (160) for focusing the excitation light (30) onto the reflective surface (227), and/or a lens portion (174) for collimating the output of signal recovery light (32) from the waveguide (228). An iterative method may be used for designing any particular lens portion (160, 174).

Abstract: The present invention provides an optical assay apparatus that includes a light source module and an optical sensor. The light source module produces light having a range of propagation angles. The sensor includes a light adjusting portion and an assay sensing portion. The light adjusting portion receives the light produced by the light source module and provides light having a propagation angle that is substantially constant to the assay sensing portion. In one embodiment, the sensor may be coupled with the light source module by an interrogation module which includes a window in which a waveguide is integrated. In another embodiment, the sensor and interrogation module are mounted in an automated assay platform that provides two-dimensional or three-dimensional movement of the sensor so that it can be sequentially immersed in solutions required to perform a particular assay protocol.

Abstract: An integral heat pipe for transferring heat away from electronic components is disclosed. The heat pipe comprises at least one electronic component mounted to a substrate. A condenser cap is fastened over the substrate to define a sealed pipe chamber around the electronic component. The top of the condenser cap facing the component is a condenser surface and is provided with a number of parallel fluted sections. Each fluted section has parallel vertical sidewalls and a semi-circular top section. A multi-layered fiberous, porous, wick is located between the condenser surface flutes and the top of the electrical component. The top of the component may be provided with a number of parallel grooves exposed to the wick. The pipe chamber is filled with a two-phase working fluid. The heat generated by the electrical component causes the liquid fraction of the working fluid adjacent the component to evaporate. The vapor travels to the fluted condensing surface.