Patents by Inventor Elsa Kam-Lum

Elsa Kam-Lum has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Magnetic Field Sensors and Methods for Fabricating the Magnetic Field Sensors
    Publication number: 20130264667
    Abstract: Magnetic field sensors and associated methods of manufacturing the magnetic field sensors include molded structures to encapsulate a magnetic field sensing element and an associated die attach pad of a lead frame and to also encapsulate or form a magnet or a flux concentrator.
    Type: Application
    Filed: March 15, 2013
    Publication date: October 10, 2013
    Applicant: Allegro Microsystems, Inc.
    Inventors: Virgil Ararao, Nirmal Sharma, Raymond W. Engel, Jay Gagnon, John B. Sauber, William P. Taylor, Elsa Kam-Lum
  • Magnetic Field Sensors and Methods for Fabricating the Magnetic Field Sensors
    Publication number: 20130267043
    Abstract: Magnetic field sensors and associated methods of manufacturing the magnetic field sensors include molded structures to encapsulate a magnetic field sensing element and an associated die attach pad of a lead frame and to also encapsulate or form a magnet or a flux concentrator.
    Type: Application
    Filed: March 15, 2013
    Publication date: October 10, 2013
    Applicant: Allegro Microsystems, Inc.
    Inventors: Virgil Ararao, Nirmal Sharma, Raymond W. Engel, Jay Gagnon, John B. Sauber, William P. Taylor, Elsa Kam-Lum
  • Magnetic field sensors and methods for fabricating the magnetic field sensors
    Patent number: 8486755
    Abstract: Magnetic field sensors and associated methods of manufacturing the magnetic field sensors include molded structures to encapsulate a magnetic field sensing element and an associated die attach pad of a lead frame and to also encapsulate or form a magnet or a flux concentrator.
    Type: Grant
    Filed: December 5, 2008
    Date of Patent: July 16, 2013
    Assignee: Allegro Microsystems, LLC
    Inventors: Virgil Ararao, Nirmal Sharma, Raymond W. Engel, Jay Gagnon, John Sauber, William P. Taylor, Elsa Kam-Lum
  • Magnetic field sensors and methods for fabricating the magnetic field sensors
    Patent number: 8461677
    Abstract: Magnetic field sensors and associated methods of manufacturing the magnetic field sensors include molded structures to encapsulate a magnetic field sensing element and an associated die attach pad of a lead frame and to also encapsulate or form a magnet or a flux concentrator.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: June 11, 2013
    Assignee: Allegro Microsystems, LLC
    Inventors: Virgil Ararao, Nirmal Sharma, Raymond W. Engel, Jay Gagnon, John Sauber, William P. Taylor, Elsa Kam-Lum
  • Magnetic Field Sensors and Methods for Fabricating the Magnetic Field Sensors
    Publication number: 20120013333
    Abstract: Magnetic field sensors and associated methods of manufacturing the magnetic field sensors include molded structures to encapsulate a magnetic field sensing element and an associated die attach pad of a lead frame and to also encapsulate or form a magnet or a flux concentrator.
    Type: Application
    Filed: September 23, 2011
    Publication date: January 19, 2012
    Applicant: ALLEGRO MICROSYSTEMS, INC.
    Inventors: Virgil Ararao, Nirmal Sharma, Raymond W. Engel, Jay Gagnon, John Sauber, William P. Taylor, Elsa Kam-Lum
  • Magnetic Field Sensors and Methods for Fabricating the Magnetic Field Sensors
    Publication number: 20100141249
    Abstract: Magnetic field sensors and associated methods of manufacturing the magnetic field sensors include molded structures to encapsulate a magnetic field sensing element and an associated die attach pad of a lead frame and to also encapsulate or form a magnet or a flux concentrator.
    Type: Application
    Filed: December 5, 2008
    Publication date: June 10, 2010
    Inventors: Virgil Ararao, Nirmal Sharma, Raymond W. Engel, Jay Gagnon, John Sauber, William P. Taylor, Elsa Kam-Lum
  • Bonding electronic component to molded package
    Patent number: 4230754
    Abstract: An electronic component with leads attached is cleaned, a layer of an epoxy or epoxy-reactive silane is applied and cured, and then the package material is molded on. The silane layer bonds the component to the package and provides a fluid-tight seal therebetween. The silane is gamma-glycidoxypropyl- or gamma-aminopropyltrimethoxy or triethoxy silane.
    Type: Grant
    Filed: November 7, 1978
    Date of Patent: October 28, 1980
    Assignee: Sprague Electric Company
    Inventors: John P. Maher, Elsa Kam-Lum