Abstract: A semiconductor device includes a substrate, a die assembly attachable to the substrate and a flexible strip extending over the substrate and the die assembly. The flexible strip has one or more routing circuits carried thereon. The die assembly and the substrate are arranged to be electrically connected through the one or more routing circuits carried on the flexible strip.

Abstract: An integrated circuit package is proposed in which a laminar substrate 41 is provided with an aperture 43. A heat-spreader member 1 is mounted to cover this aperture 43, and contains a cavity 3 opening towards the aperture 43 in the substrate 41. A stack of integrated circuit circuits 11, 21, are located with one integrated circuit 21 of the stack inserted into the cavity 3, and one integrated circuit 11 of the stack electrically connected to the substrate 41.

Abstract: An integrated circuit package includes a flexible laminar substrate 1. The substrate 1 has a flexible layer 5 of heat conductive material on one of its faces. The layer 5 extends across an aperture 9 in the flexible substrate 1. A first integrated circuit 11 is mounted on the layer 5 within the aperture 9, and wire bonded to the substrate 1. A flip chip 21 is mounted on the first integrated circuit 11. The two integrated circuits 11, 21 are embedded in a resin body 23.

Abstract: A method of packaging integrated circuits is proposed in which two integrated circuits 13, 17 are provided in register on opposite sides of a single substrate 1. Electrical contacts on the each of the integrated circuits 13, 17 are electrically connected to electrical conductors of the substrate 1. One of the integrated circuits 17 may be wire bonded to the substrate, while the other is a flip-chip 13. Holes 7 are provided through the substrate 1 so that in a moulding operation a single resin body 21 may be formed encasing both of the integrated circuits 13, 17 by applying resin only to an upper side of the substrate 1 and allowing the resin to flow to the other side of the substrate 1 into a volume defined by a box 15.

Abstract: An integrated circuit (27, 67) is packaged by mounting it onto a substrate (11, 55) with a heat conductive plate (1, 41) interposed between the integrated circuit (27, 67) and the substrate (11, 55). The plate (1, 41) has portions (5, 7, 9) extending laterally out from under the integrated circuit, and these portions conduct away heat generated by the integrated circuit (27, 67). The plate (1, 41) may be connected to ground, and be connected by wire bonding to pads of the integrated circuit (27, 67) which are to be grounded. In one arrangement, the plate (1) may be located above a second integrated circuit such as a flipchip (22). In another arrangement, a plurality of integrated circuits (67) may be connected to the substrate (55) via the plate (41), and the substrate (55) and plate (41) singulated together to form a plurality of packages.