Patents by Inventor Elvin M. Vauss, Jr.

Elvin M. Vauss, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4657650
    Abstract: An arrangement for an electrical connector is disclosed comprising a first conductor member, an oppositely spaced second conductor member, a reticulated electrical interface therebetween, and means for fastening together the first and second members and the reticulated electrical interface. In one embodiment the arrangement comprises a high current bus connector. In another arrangement an electrolytic cell is provided. The reticulated interface comprises a network of open-pore cells constructed of an electrically-conductive material. The arrangement is preferably assembled such that the reticulated network is compressed between the first and second conductor members to deform and mateably engage the members for close, current-communicative cooperation therebetween. In another embodiment of the present invention, the reticulate interface material includes side wall portions having a plurality of reticulate edge points on the side wall surfaces.
    Type: Grant
    Filed: June 22, 1984
    Date of Patent: April 14, 1987
    Assignee: ELTECH Systems Corporation
    Inventors: Elvin M. Vauss, Jr., Andrew J. Niksa
  • Patent number: 4568441
    Abstract: A solid polymer electrolyte (SPE), solid polymer electrolyte electrode, and method for forming from cationic exchange perfluorocarbon copolymer. Disclosed are solution techniques for forming SPE's and SPE electrodes using fluorocarbon vinyl ether copolymers.
    Type: Grant
    Filed: September 4, 1984
    Date of Patent: February 4, 1986
    Assignee: Eltech Systems Corporation
    Inventors: Michael J. Covitch, Donald L. DeRespiris, Leo L. Benezra, Elvin M. Vauss, Jr.
  • Patent number: 4517069
    Abstract: A self-supporting reticulate of titanium hydride (TiH.sub.2) is formed by slurry-coating an open cell organic synthetic resinous material, or other pore-former, and eliminating the carbon-containing components of binder and/or solvent, viscosity modifiers, thickening agents, and the like at a temperature below about 400.degree. C. In an analogous manner, an inorganic refractory material open cell substrate or other pore-former substrate may be slurry-coated and converted to a TiH.sub.2 reticulate in which the substrate is coated with TiH.sub.2 to yield a supported TiH.sub.2 reticulate. Either the self-supporting TiH.sub.2 reticulate, or the supported one, free of carbonaceous material, may be sintered to yield an essentially pure Ti (metal) reticulate which is essentially free of titanium carbide. Ti reticulates so formed are coated with Pt group metal oxides and used as anodes in chloroalkali cells.
    Type: Grant
    Filed: July 1, 1983
    Date of Patent: May 14, 1985
    Assignee: Eltech Systems Corporation
    Inventors: Marilyn J. Harney, Elvin M. Vauss, Jr., Ajit Y. Sane