Patents by Inventor Elvira Buchholtz

Elvira Buchholtz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Technique for forming interconnect structures with reduced electro and stress migration and/or resistivity
    Patent number: 7375031
    Abstract: By improving the purity of metal lines and the crystalline structure, the overall performance of metal lines, especially of highly scaled copper-based semiconductor devices, may be enhanced. The modification of the crystalline structure of the metal lines may be performed by a heat treatment generating locally restricted heating zones, which are scanned along the length direction of the metal lines, and/or a heat treatment comprising a heating step in a vacuum ambient followed by a heating step in a reducing ambient.
    Type: Grant
    Filed: December 2, 2005
    Date of Patent: May 20, 2008
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Axel Preusse, Markus Keil, Wolfgang Buchholtz, Petra Hetzer, Elvira Buchholtz
  • Technique for forming interconnect structures with reduced electro and stress migration and/or resistivity
    Publication number: 20060223311
    Abstract: By improving the purity of metal lines and the crystalline structure, the overall performance of metal lines, especially of highly scaled copper-based semiconductor devices may be enhanced. The modification of the crystalline structure of the metal lines may be performed by a heat treatment generating locally restricted heating zones, which are scanned along the length direction of the metal lines.
    Type: Application
    Filed: November 1, 2005
    Publication date: October 5, 2006
    Inventors: Wolfgang Buchholtz, Petra Hetzer, Elvira Buchholtz