Abstract: A calibration and part inspection method for the inspection of ball grid array, BGA, devices. Two cameras image a precision pattern mask with dot patterns deposited on a transparent reticle. The precision pattern mask is used for calibration of the system. A light source and overhead light reflective diffuser provide illumination. A first camera images the reticle precision pattern mask from directly below. An additional mirror or prism located below the bottom plane of the reticle reflects the reticle pattern mask from a side view, through prisms or reflective surfaces, into a second camera and a second additional mirror or prism located below the bottom plane of the reticle reflects the opposite side view of the reticle pattern mask through prisms or mirrors into a second camera. By imaging more than one dot pattern the missing state values of the system can be resolved using a trigonometric solution.

Abstract: An apparatus for three dimensional inspection of an electronic part which has a camera and illuminator for imaging a first view of the electronic part. An optical element is positioned to reflect a different view of the electronic part into the camera, and the camera thus provides an image of the electronic part having differing views of the electronic part. An image processor applies calculations on the differing views to calculate a three dimensional position of at least one portion of the electronic part.

Abstract: A calibration and part inspection method for the inspection of ball grid array, BGA, devices. Two cameras image a precision pattern mask with dot patterns deposited on a transparent reticle. The precision pattern mask is used for calibration of the system. A light source and overhead light reflective diffuser provide illumination. A first camera images the reticle precision pattern mask from directly below. An additional mirror or prism located below the bottom plane of the reticle reflects the reticle pattern mask from a side view, through prisms or reflective surfaces, into a second camera and a second additional mirror or prism located below the bottom plane of the reticle reflects the opposite side view of the reticle pattern mask through prisms or mirrors into a second camera. By imaging more than one dot pattern the missing state values of the system can be resolved using a trigonometric solution.

Abstract: A calibration and part inspection method for the inspection of ball grid array, BGA, devices. One or more cameras image a precision pattern mask with dot patterns deposited on a transparent reticle. The precision pattern mask is used for calibration of the system. A light source and overhead light reflective diffuser provide illumination. A camera images the reticle precision pattern mask from directly below. An additional mirror or prism located below the bottom plane of the reticle reflects the reticle pattern mask from a side view, through prisms or reflective surfaces, into the camera. By imaging more than one dot pattern the missing state values of the system can be resolved using a trigonometric solution. The reticle with the pattern mask is removed after calibration and the BGA to be inspected is placed with the balls facing downward, in such a manner as to be imaged by a single camera, or optionally, via additional cameras.

Abstract: A calibration and part inspection method for the inspection of ball grid array, BGA, devices. One or more cameras image a precision pattern mask with dot patterns deposited on a transparent reticle. The precision pattern mask is used for calibration of the system. A light source and overhead light reflective diffuser provide illumination. A camera images the reticle precision pattern mask from directly below. An additional mirror or prism located below the bottom plane of the reticle reflects the reticle pattern mask from a side view, through prisms or reflective surfaces, into the camera. By imaging more than one dot pattern the missing state values of the system can be resolved using a trigonometric solution. The reticle with the pattern mask is removed after calibration and the BGA to be inspected is placed with the balls facing downward, in such a manner as to be imaged by a single camera, or optionally, via additional cameras.

Abstract: A three dimensional inspection system for inspecting ball array devices having a plurality of balls, where the ball array device is positioned in an optical system. An illuminator is located to illuminate at least one ball on the ball array device. A first optical element is positioned to transmit light to the sensor. A second optical element is positioned to direct light from the at least one ball to the sensor, where the sensor, the first optical element and the second optical element cooperate to obtain at least two differing views of the at least one ball, the sensor providing an output representing the at least two differing views. A processor is coupled to receive the output, where the processor processes the output by using a triangulation method to calculate a three dimensional position of the at least one ball with reference to a pre-calculated calibration plane.

Abstract: A three dimensional inspection method for inspecting ball array devices having a plurality of balls, where the ball array device is positioned in an optical system. The inspection method includes the steps of illuminating at least one ball on the ball array device, and disposing a sensor, a first optical element and a second optical element in relation to the ball array device so that the sensor obtains at least two differing views of the at least one ball, the sensor providing an output representing the at least two differing views. The output is processed using a triangulation method to calculate a three dimensional position of the at least one ball with reference to a pre-calculated calibration plane.

Abstract: An apparatus for three dimensional inspection of an electronic part which has a camera and illuminator for imaging a first view of the electronic part. An optical element is positioned to reflect a different view of the electronic part into the camera, and the camera thus provides an image of the electronic part having differing views of the electronic part. An image processor applies calculations on the differing views to calculate a three dimensional position of at least one portion of the electronic part.

Abstract: A three dimensional inspection system for inspecting ball array devices having a plurality of balls, where the ball array device is positioned in an optical system. An illuminator is located to illuminate at least one ball on the ball array device. A first optical element is positioned to transmit light to the sensor. A second optical element is positioned to direct light from the at least one ball to the sensor, where the sensor, the first optical element and the second optical element cooperate to obtain at least two differing views of the at least one ball, the sensor providing an output representing the at least two differing views. A processor is coupled to receive the output, where the processor processes the output by using a triangulation method to calculate a three dimensional position of the at least one ball with reference to a pre-calculated calibration plane.

Abstract: A three dimensional inspection method for inspecting ball array devices having a plurality of balls, where the ball array device is positioned in an optical system. The inspection method includes the steps of illuminating at least one ball on the ball array device, and disposing a sensor, a first optical element and a second optical element in relation to the ball array device so that the sensor obtains at least two differing views of the at least one ball, the sensor providing an output representing the at least two differing views. The output is processed using a triangulation method to calculate a three dimensional position of the at least one ball with reference to a pre-calculated calibration plane.

Abstract: A calibration and part inspection method and apparatus for the inspection of ball grid array, BGA, devices. Two cameras image a precision pattern mask with dot patterns deposited on a transparent reticle. The precision pattern mask is used for calibration of the system. A light source and overhead light reflective diffuser provide illumination. A first camera images the reticle precision pattern mask from directly below. An additional mirror or prism located below the bottom plane of the reticle reflects the reticle pattern mask from a side view, through prisms or reflective surfaces, into a second camera and a second additional mirror or prism located below the bottom plane of the reticle reflects the opposite side view of the reticle pattern mask through prisms or mirrors into a second camera. By imaging more than one dot pattern the missing state values of the system can be resolved using a trigonometric solution.

Abstract: A three dimensional inspection process for ball array devices. The ball array device is positioned in a fixed optical system. The ball array device is illuminated and a first image of the ball array device is taken with a first camera disposed in a fixed focus position relative to the ball array device to obtain a characteristic circular doughnut shape image from a ball. A second image of the ball array device is taken with a second camera disposed in a fixed focus position relative to the ball array device to obtain a top surface image of the ball. The first image and the second image are processed using a triangulation method to calculate a three dimensional position of the ball with reference to a pre-calculated calibration plane.

Abstract: A three dimensional inspection apparatus for ball array devices, where the ball array device is positioned in a fixed optical system. An illumination apparatus is positioned for illuminating the ball array device. A first camera is disposed in a fixed focus position relative to the ball array device for taking a first image of the ball array device to obtain a characteristic circular doughnut shape image from a ball. A second camera is disposed in a fixed focus position relative to the ball array device for taking a second image of the ball array device to obtain a top surface image of the ball. A processor applies triangulation calculations on related measurements of the first image and the second image to calculate a three dimensional position of the ball with reference to a pre-calculated calibration plane.

Abstract: A part inspection and calibration method for the inspection of printed circuit boards and integrated circuits includes a camera to image a precision pattern mask deposited on a transparent reticle. Small parts are placed on or above the transparent reticle to be inspected. An overhead mirror or prism reflects a side view of the part under inspection to the camera. The scene of the part is triangulated and the dimensions of the system can thus be calibrated. A precise reticle mask with dot patterns gives an additional set of information needed for calibration. By imagining more than one dot pattern the missing state values can be resolved using an iterative trigonometric solution. The system optics are designed to focus images for all perspectives without the need for an additional focusing element.

Abstract: A part inspection and calibration method for the inspection of integrated circuits includes a camera to image a precision pattern mask deposited on a transparent reticle. Small parts are placed on or above the transparent reticle to be inspected. A light source and overhead light reflective diffuser provide illumination. An overhead mirror or prism reflects a side view of the part under inspection to the camera. The scene of the part is triangulated and the dimensions of the system can thus be calibrated. A reference line is located on the transparent reticle to allow an image through the prism to the camera of the reference line between the side view and the bottom view. A precise reticle mask with dot patterns gives an additional set of information needed for calibration. By imaging more than one dot pattern the missing state values can be resolved using an iterative trigonometric solution.

Abstract: An array of touch sensors are brought in contact with a ball grid array. A linear actuator moves the array of touch sensors. The position of the linear actuator is known very precisely. As the touch sensors encounter the ball grid array, they provide a signal to a computer system that an element on the ball grid array has been encountered. The computer notes the position of the linear actuator and the particular sensor in the touch sensor array that is providing the signal. Initially, each touch sensor rests against a printed circuit board circuit with a conductive disk connecting the circuit in an unactuated position. In an actuated position, the circuit is broken by the touch sensor being forced away from the printed circuit board by the object encountered. Positive air pressure is provided against one side of the disk to press it against the contact points on the printed circuit board. An alignment plate helps prevent tilting of a touch sensor.

Abstract: A method for part placement of a semiconductor chip for inspection where the semiconductor chip has a plurality of leads defining a seating plane and a body having a top. The method includes the steps of placing the body on a platform in an up position where the plurality of leads are suspended and probing the top of the body. Next measuring the position of the top of the body with reference to a predetermined coordinate system is done. Then the part is moved until the part is suspended on the plurality of leads on a reference plane. The top of the body is then probed for a second time, and the second position of the top of the body is measured with reference to the predetermined coordinate system. The thickness of the part is then determined as the distance between the top of the part and its seating plane.

Abstract: A part scanning and part calibration method for the inspection of printed circuit boards and integrated circuits includes a camera and two rotating mirrors to scan an image of a pattern mask retical upon which a precise pattern has been deposited. Small parts are placed upon the retical to be inspected. The third overhead mirror is provided to view the part under inspection from another perspective. The scene of the part is triangulated and the dimensions of the system can thus be calibrated. A precise retical mask is provided with dot patterns which provide an additional set of information needed for calibration. By scanning more than one dot pattern the missing state values can be resolved using an iterative trigonomic solution.

Abstract: A part scanning and part calibration apparatus and mechanism for the inspection of printed circuit boards and integrated circuits include a camera and two rotating mirrors to scan an image of a pattern mask retical upon which a precise pattern has been deposited. Small parts are placed upon the retical to be inspected. The third overhead mirror is provided to view the part under inspection from another perspective. The scene of the part is triangulated and the dimensions of the system can thus be calibrated. A precise retical mask is provided with dot patterns which provide an additional set of information needed for calibration. By scanning more then one dot pattern the missing state values can be resolved using an iterative trigonomic solution.