Abstract: According to a first aspect there is provided a light emitting diode (LED) package. The LED package comprises a heat spreader having a first side and a second side, the first side having a planar surface and the second side being asymmetrical relative to the first side. One or more LED die are mounted on a surface of the second side of the heat spreader. In particular, the surface of the second side of the heat spreader can be shaped or angled relative to the planar surface the surface of the first side.

Abstract: The present invention proposes a method of manufacturing a ball grid array printed circuit board (210) that comprises the following steps: fabricating a printed circuit board, PCB, that comprises a matrix of ball grid array PCBs, each ball grid array PCB of the matrix is separated from its neighbors by the width of an electroplating tie bar (230); stamping the matrix of ball grid array PCBs for separating them and for forming an aperture (320) that is substantially centralized within each of them; preparing a metal sheet (510), onto which a semiconductor device (130) is mechanically attached; mechanically attaching a singularized ball grid array PCB to the metal sheet; and molding about the semiconductor device and a portion of the ball grid array PCB a protective material (140) that is substantially planar with respect to the ball grid array PCB.