Patents by Inventor Emad B. Hreish

Emad B. Hreish has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for electromechanical testing and validation of probe cards
    Patent number: 6911814
    Abstract: A method of testing a probe card includes the step of positioning the probe card in a prober over a verification wafer that is placed on a stage. The probe card is brought in contact with a contact region on the verification wafer. The verification wafer includes a shorting plane surrounding the contact region. A test signal is sent through the verification wafer to the probe card. A response signal from the probe card is received and analyzed.
    Type: Grant
    Filed: July 1, 2003
    Date of Patent: June 28, 2005
    Assignee: FormFactor, Inc.
    Inventors: Charles A. Miller, Emad B. Hreish
  • High frequency printed circuit board via
    Patent number: 6661316
    Abstract: A printed circuit board (PCB) via, providing a conductor extending vertically between microstrip or stripline conductors formed on separate layers of a PCB, includes a conductive pad surrounding the conductor and embedded within the PCB between those PCB layers. The pad's shunt capacitance and the magnitudes of capacitances of other portions of the via are sized relative to the conductor's inherent inductance to optimize frequency response characteristics of the via.
    Type: Grant
    Filed: December 3, 2002
    Date of Patent: December 9, 2003
    Assignee: FormFactor, Inc.
    Inventors: Emad B. Hreish, Charles A. Miller
  • High frequency printed circuit board via
    Publication number: 20030080835
    Abstract: A printed circuit board (PCB) via, providing a conductor extending vertically between microstrip or stripline conductors formed on separate layers of a PCB, includes a conductive pad surrounding the conductor and embedded within the PCB between those PCB layers. The pad's shunt capacitance and the magnitudes of capacitances of other portions of the via are sized relative to the conductor's inherent inductance to optimize frequency response characteristics of the via.
    Type: Application
    Filed: December 3, 2002
    Publication date: May 1, 2003
    Applicant: FormFactor, Inc.
    Inventors: Emad B. Hreish, Charles A. Miller
  • High frequency printed circuit board via
    Patent number: 6538538
    Abstract: A printed circuit board (PCB) via, providing a conductor extending vertically between microstrip or stripline conductors formed on separate layers of a PCB, includes a conductive pad surrounding the conductor and embedded within the PCB between those PCB layers. The pad's shunt capacitance and the magnitudes of capacitances of other portions of the via are sized relative to the conductor's inherent inductance to optimize frequency response characteristics of the via.
    Type: Grant
    Filed: January 16, 2001
    Date of Patent: March 25, 2003
    Assignee: FormFactor, Inc.
    Inventors: Emad B. Hreish, Charles A. Miller
  • High frequency printed circuit board via
    Publication number: 20020130737
    Abstract: A printed circuit board (PCB) via, providing a conductor extending vertically between microstrip or stripline conductors formed on separate layers of a PCB, includes a conductive pad surrounding the conductor and embedded within the PCB between those PCB layers. The pad's shunt capacitance and the magnitudes of capacitances of other portions of the via are sized relative to the conductor's inherent inductance to optimize frequency response characteristics of the via.
    Type: Application
    Filed: January 16, 2001
    Publication date: September 19, 2002
    Inventors: Emad B. Hreish, Charles A. Miller