Abstract: An automatic sample processing system containing:a) a sample vessel,b) a sample vessel carrier having a chamber to receive the sample vessel, andc) a sample identification component which carries a readable identification of a sample. The sample identification component is removably attachable to the sample vessel and to the sample vessel carrier.

Abstract: A throwaway arrangement of reaction containers each having the same shape and dimensions for bringing about temperature cycles in a liquid mixture contained within the reaction containers. Each reaction container having a first conical wall region, and a second cylindrical wall region which at one end forms the opening of the reaction container. The thickness of the first wall region is less than the thickness of the second wall region. The opening of the reaction container is adapted to receive a cover for closing the container in gas-tight manner when placed on the opening of the reaction container. To facilitate handling and access to the liquids in the reaction containers, the arrangement reaction containers is annular, and the closure of each reaction container can be pierced by a pipetting needle.

Abstract: The present invention relates to a device for forming electric circuits on a lead frame, which has a plurality of process points in a row, each of which is provided with a semiconductor chip. During bonding, for achieving an optimum ultrasonic power transfer necessary for the electric connection of the semiconductor chip (8) to the connection fingers (5) of the lead frame, the individual lead frame (1) is located between a heated bearing element (19) and a correspondingly constructed holding plate (40). In the case of the device (50) according to the invention, the holding plate (40) provided for a contacting member (transducer) with a correspondingly constructed window-like recess (45) is movably mounted relative to the bearing element (19) about at least one axis (S) oriented in the longitudinal direction of the holding plate (40) on two spaced studs (35, 35'), each of which is arranged on a spring element (34, 34').

Abstract: A method and an apparatus for preparing a bonding wire, such as gold wire, drawn in contact-free manner from a bonding wire spool mounted in rotary manner about its longitudinal axis and supplied to a bonding device for forming circuits on electronic components. The apparatus constructed as a subassembly essentially comprises an electromotively-driven bonding wire spool carrier arranged on a support plate and a removal station provided with an optronic sensor. The bonding wire is deflected by means of air flows (P' or Q') for forming a bonding wire reserve in the removal station and the wire position is scanned by the optronic sensor. In the case of a decreasing bonding wire reserve, a signal is produced as a function of the bonding wire position, which is processed in a signal evaluation unit and is transmitted to a control unit, by means of which an electromotive drive operatively connected with the spool carrier is operated.