Patents by Inventor Emanuele STAVAGNA

Emanuele STAVAGNA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor devices comprising electrical redistribution layer along with ground line and signal line and methods for manufacturing thereof
    Patent number: 11798874
    Abstract: A semiconductor device includes a semiconductor chip including an electrical contact arranged on a main surface of the semiconductor chip, an external connection element configured to provide a first electrical connection between the semiconductor device and a printed circuit board, and an electrical redistribution layer extending in a direction parallel to the main surface of the semiconductor chip and configured to provide a second electrical connection between the electrical contact of the semiconductor chip and the external connection element. The electrical redistribution layer includes a ground line connected to a ground potential and a signal line configured to carry an electrical signal having a wavelength.
    Type: Grant
    Filed: November 29, 2021
    Date of Patent: October 24, 2023
    Assignee: Infineon Technologies AG
    Inventors: Walter Hartner, Francesca Arcioni, Tuncay Erdoel, Vincenzo Fiore, Helmut Kollmann, Arif Roni, Emanuele Stavagna, Christoph Wagner
  • SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING THEREOF
    Publication number: 20220181246
    Abstract: A semiconductor device includes a semiconductor chip including an electrical contact arranged on a main surface of the semiconductor chip, an external connection element configured to provide a first electrical connection between the semiconductor device and a printed circuit board, and an electrical redistribution layer extending in a direction parallel to the main surface of the semiconductor chip and configured to provide a second electrical connection between the electrical contact of the semiconductor chip and the external connection element. The electrical redistribution layer includes a ground line connected to a ground potential and a signal line configured to carry an electrical signal having a wavelength.
    Type: Application
    Filed: November 29, 2021
    Publication date: June 9, 2022
    Inventors: Walter HARTNER, Francesca ARCIONI, Tuncay ERDOEL, Vincenzo FIORE, Helmut KOLLMANN, Arif RONI, Emanuele STAVAGNA, Christoph WAGNER