Patents by Inventor Emerson Network Power - Embedded Computing, Inc.

Emerson Network Power - Embedded Computing, Inc. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140254106
    Abstract: An ejector lever locking mechanism rotatably connected to a heat frame and releasably engaged to a module body includes a lever body rotatably connected to the heat frame. The lever body includes a recessed wall created in a lever body elongated slot. The elongated slot extends only partially through a body thickness of the lever body. The recessed wall is positioned proximate to a lever body aperture defining a through aperture extending through the lever body including the elongated slot. A lock pin has a first portion fixed to a module body and a second portion extending through the lever body aperture. The second portion has an engagement member overlapping the recessed wall defining a lever body engaged position acting to releasably connect the heat frame and circuit board assembly to an electronics cabinet.
    Type: Application
    Filed: March 11, 2013
    Publication date: September 11, 2014
    Applicant: EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
    Inventor: Emerson Network Power-Embedded Computing, Inc.
  • Publication number: 20140217870
    Abstract: An electrical equipment cabinet cooling device includes an electrical equipment cabinet having a cabinet outer frame defining an inner perimeter wall. A planar outer cabinet wall is positioned within the inner perimeter wall. A two-phase thermal device includes spaced and opposed first and second transfer walls. An outer perimeter wall connects the first and second transfer walls and defines an interior sealed cavity between the first and second transfer walls. The outer perimeter wall is sized for slidable receipt within the inner perimeter wall. A liquid/vapor retained in the interior sealed cavity acts as a heat transfer medium between the first and second transfer walls. A convective cooling block has a planar end face in direct contact with the second transfer wall. Heat transfers to atmosphere in a path including the outer cabinet wall, the first transfer wall, the liquid/vapor, the second transfer wall, and the cooling block.
    Type: Application
    Filed: February 1, 2013
    Publication date: August 7, 2014
    Applicant: EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
    Inventor: EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
  • Publication number: 20140174693
    Abstract: A configurable electronics cabinet cooling system includes a cabinet having multiple walls including at least one universal cabinet wall. The universal cabinet wall has a planar outward facing surface and multiple apertures. A heat transfer component is releasably connected to the universal cabinet wall. The heat transfer component is selected from either a conductive cooling member or a convective cooling member each adapted to be interchangeably and releasably connected to the universal cabinet wall using fasteners extending through same ones of the apertures. Each of the conductive cooling member and the convective cooling member includes a planar surface, the planar surface adapted to directly contact the outward facing surface of the universal cabinet wall.
    Type: Application
    Filed: December 21, 2012
    Publication date: June 26, 2014
    Applicant: EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
    Inventor: Emerson Network Power - Embedded Computing, Inc.