Patents by Inventor Emi Kim

Emi Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10100156
    Abstract: The curable resin composition of the present technology includes: (A) a straight-chain organopolysiloxane having at least two silicon-bonded hydrogen atoms and at least one aryl group in one molecule and having an average degree of polymerization of greater than 10; (B) a branched-chain organopolysiloxane having at least three alkenyl groups and at least one aryl group in one molecule; and (C) a hydrosilylation reaction catalyst; wherein a proportion of diphenylsiloxane units relative to an amount of all siloxane units is 10 mol % or greater, and the all siloxane units containing siloxane units derived from the straight-chain organopolysiloxane (A) and the branched-chain organopolysiloxane (B).
    Type: Grant
    Filed: December 25, 2014
    Date of Patent: October 16, 2018
    Assignee: The Yokohama Rubber Co., LTD.
    Inventors: Emi Kim, Yoshihito Takei, Motoki Takuma, Takeaki Saiki
  • Publication number: 20170002149
    Abstract: The curable resin composition of the present technology includes: (A) a straight-chain organopolysiloxane having at least two silicon-bonded hydrogen atoms and at least one aryl group in one molecule and having an average degree of polymerization of greater than 10; (B) a branched-chain organopolysiloxane having at least three alkenyl groups and at least one aryl group in one molecule; and (C) a hydrosilylation reaction catalyst; wherein a proportion of diphenylsiloxane units relative to an amount of all siloxane units is 10 mol % or greater, and the all siloxane units containing siloxane units derived from the straight-chain organopolysiloxane (A) and the branched-chain organopolysiloxane (B).
    Type: Application
    Filed: December 25, 2014
    Publication date: January 5, 2017
    Inventors: Emi Kim, Yoshlito Takei, Motoki Takuma, Takeaki Saiki
  • Publication number: 20160194457
    Abstract: Provided is a curable resin composition that contains a silicon-containing compound (A) having a silanol group and an aryl group, a silicon-containing compound (B) having at least two silicon atom-bonded hydrogen atoms and at least one aryl group in one molecule, a branched-chain organopolysiloxane (C) having an alkenyl group and an aryl group, and a hydrosilylation reaction catalyst (D).
    Type: Application
    Filed: June 12, 2014
    Publication date: July 7, 2016
    Inventors: Yoshihito Takei, Emi Kim, Takeaki Saiki
  • Patent number: 9346954
    Abstract: The object of the present invention is to provide a curable resin composition having excellent adhesion. This curable resin composition contains: a straight-chain organopolysiloxane (A) having at least two silicon-bonded hydrogen atoms and at least one aryl group in each molecule, the degree of polymerization being greater than 10; a branched-chain organopolysiloxane (B) having at least three alkenyl groups and at least one aryl group in each molecule; and a hydrosilylation reaction catalyst (C).
    Type: Grant
    Filed: August 26, 2013
    Date of Patent: May 24, 2016
    Assignee: The Yokohama Rubber Co., Ltd.
    Inventors: Emi Kim, Yoshihito Takei, Tsubasa Ito, Kazunori Ishikawa
  • Publication number: 20150252191
    Abstract: The object of the present invention is to provide a curable resin composition having excellent adhesion. This curable resin composition contains: a straight-chain organopolysiloxane (A) having at least two silicon-bonded hydrogen atoms and at least one aryl group in each molecule, the degree of polymerization being greater than 10; a branched-chain organopolysiloxane (B) having at least three alkenyl groups and at least one aryl group in each molecule; and a hydrosilylation reaction catalyst (C).
    Type: Application
    Filed: August 26, 2013
    Publication date: September 10, 2015
    Inventors: Emi Kim, Yoshihito Takei, Tsubasa Ito, Kazunori Ishikawa