Patents by Inventor Emi Lee

Emi Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermoformable honeycomb structures
    Patent number: 6245407
    Abstract: Resins which are a combination of phenolic and polyamide polymers are used as dipping resins to coat composite honeycomb structures. The phenolic/polyamide dipping resins increase the heat formability of composite honeycomb structures. The dip resin forms a coating on the honeycomb which includes from 30 to 95 weight percent phenolic resin and 5 to 30 weight percent polyamide resin. The dip resin is especially useful for coating composite honeycomb cores made from graphite or glass fibers impregnated with flexible phenolic resins.
    Type: Grant
    Filed: April 27, 1999
    Date of Patent: June 12, 2001
    Assignee: Hexcel Corporation
    Inventors: Yen-Seine Wang, Emi Lee, Mark S. Caldwell, Robert Petrisko