Patents by Inventor Emi Matsui
Emi Matsui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11322384Abstract: According to one embodiment, a substrate processing apparatus and a substrate processing method that can improve the quality of substrates are provided.Type: GrantFiled: September 28, 2020Date of Patent: May 3, 2022Assignees: SHIN-ETSU ENGINEERING CO., LTD., SHIBAURA MECHATRONICS CORPORATIONInventors: Shunya Kubota, Emi Matsui, Katsuhiro Yamazaki, Yoshikazu Ohtani, Kyouhei Tomioka
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Publication number: 20210098279Abstract: According to one embodiment, a substrate processing apparatus and a substrate processing method that can improve the quality of substrates are provided.Type: ApplicationFiled: September 28, 2020Publication date: April 1, 2021Applicants: SHIN-ETSU ENGINEERING CO., LTD., SHIBAURA MECHATRONICS CORPORATIONInventors: Shunya KUBOTA, Emi MATSUI, Katsuhiro YAMAZAKI, Yoshikazu OHTANI, Kyouhei TOMIOKA
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Patent number: 10586727Abstract: A suction stage may include a mounting section configured to mount a first substrate, and an evacuation section configured to evacuate air between the first substrate and the mounting section. The mounting section includes a ring-shaped first wall part, and a ring-shaped second wall part inside the first wall part. The evacuation section includes a first control valve between the evacuation section and a first region between the first and second wall parts, a second control valve between the evacuation section and a second region inside the second wall part, and a control section configured to control the valves. The control section is configured to control the valves so that suction and non-suction of the first substrate are alternately performed in at least one of the regions. Thus, suction of the first substrate may be deactivated in one of the regions, while the suction is active in the other region.Type: GrantFiled: September 24, 2014Date of Patent: March 10, 2020Assignee: Shibaura Mechatronics CorporationInventors: Emi Matsui, Konosuke Hayashi, Takahiro Kanai
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Patent number: 9811096Abstract: A liquid feeding device that feeds a treatment liquid to a treating device and also recovers the treatment liquid for re-feeding, include feeding tanks having an exhaust passage and an overflow line, and can be switched to one of a feeding mode in which the treatment liquid is fed and a standby mode in which the feeding tank is on standby while accommodating the treatment liquid; a feeding mechanism that feeds the treatment liquid to the treating device from the feeding tank in the feeding mode among the plurality of feeding tanks; a recovery mechanism that recovers and returns the treatment liquid excessive in the treatment device to the feeding tank in the feeding mode; and an on-off mechanism provided in each of the plurality of feeding tanks to block the exhaust passage and the overflow line is provided.Type: GrantFiled: November 12, 2015Date of Patent: November 7, 2017Assignee: SHIBAURA MECHATRONICS CORPORATIONInventors: Konosuke Hayashi, Takashi Ootagaki, Emi Matsui
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Patent number: 9741596Abstract: According to one embodiment, a bonding apparatus for processing a retained substrate includes a main body unit, a nozzle, a gas supply unit, and a substrate support unit. The nozzle opens on a face of the main body unit on a side that a first substrate is retained. The gas supply unit is configured to supply gas to the nozzle, to apply suction to the first substrate and to separate the substrate from the face of the main body unit. The substrate support unit is configured to support a peripheral edge portion of a second substrate provided in opposition to the first substrate with a predetermined gap.Type: GrantFiled: December 23, 2013Date of Patent: August 22, 2017Assignee: SHIBAURA MECHATRONICS CORPORATIONInventors: Konosuke Hayashi, Emi Matsui
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Patent number: 9718710Abstract: According to one embodiment, a treatment apparatus includes a dialysis unit, a treatment unit and a recovery unit. The dialysis unit is configured to dialyze a solution including a phosphoric acid, a silicon compound, and water. The treatment unit is configured to perform treatment of an object to be treated using a dialyzed solution. The recovery unit is configured to recover a solution used in the treatment of the object to be treated and supply to the dialysis unit. The dialysis unit includes a transmission part which allows anions to be transmitted. The recovery unit supplies the solution used in the treatment of the object to be treated, to a region in the dialysis unit. The region is divided by the transmission part.Type: GrantFiled: July 30, 2015Date of Patent: August 1, 2017Assignee: Kabushiki Kaisha ToshibaInventors: Masaaki Hirakawa, Emi Matsui
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Publication number: 20160225655Abstract: According to the embodiment, a suction stage includes a mounting section configured to mount a first substrate, and an evacuation section configured to evacuate air between the first substrate and the mounting section. The mounting section includes a first wall part provided on an outer peripheral side of one end surface of the mounting section and shaped like a ring, and a second wall part provided inside the first wall part and shaped like a ring. The evacuation section includes a first control valve provided between the evacuation section and a first region between the first wall part and the second wall part, a second control valve provided between the evacuation section and a second region inside the second wall part, and a control section configured to control the first control valve and the second control valve.Type: ApplicationFiled: September 24, 2014Publication date: August 4, 2016Applicant: Shibaura Mechatronics CorporationInventors: Emi Matsui, Konosuke Hayashi, Takahiro Kanai
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SUBSTRATE TREATMENT DEVICE, PEELING METHOD FOR LAMINATED SUBSTRATE, AND METHOD FOR REMOVING ADHESIVE
Publication number: 20160225613Abstract: The embodiment of a substrate treatment device includes a treatment bath configured to store a treatment liquid in which a treatment object is to be immersed, a transport section configured to transport the treatment object, a temperature control section provided in at least one of the treatment bath and a position spaced from the treatment bath and configured to perform at least one of heating and cooling of the treatment object. the treatment object is at least one of: a laminated substrate including a device substrate, a support substrate, and an adhesive provided between the device substrate and the support substrate, the device substrate with the adhesive attached thereto, and the support substrate with the adhesive attached thereto.Type: ApplicationFiled: September 24, 2014Publication date: August 4, 2016Applicant: Shibaura Mechatronics CorporationInventors: Takahiro Kanai, Emi Matsui, Konosuke Hayashi -
Publication number: 20160075570Abstract: According to one embodiment, a treatment apparatus includes a dialysis unit, a treatment unit and a recovery unit. The dialysis unit is configured to dialyze a solution including a phosphoric acid, a silicon compound, and water. The treatment unit is configured to perform treatment of an object to be treated using a dialyzed solution. The recovery unit is configured to recover a solution used in the treatment of the object to be treated and supply to the dialysis unit. The dialysis unit includes a transmission part which allows anions to be transmitted. The recovery unit supplies the solution used in the treatment of the object to be treated, to a region in the dialysis unit. The region is divided by the transmission part.Type: ApplicationFiled: July 30, 2015Publication date: March 17, 2016Applicant: Kabushiki Kaisha ToshibaInventors: Masaaki HIRAKAWA, Emi Matsui
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Publication number: 20160062372Abstract: A liquid feeding device that feeds a treatment liquid to a treating device and also recovers the treatment liquid for re-feeding, include feeding tanks having an exhaust passage and an overflow line, and can be switched to one of a feeding mode in which the treatment liquid is fed and a standby mode in which the feeding tank is on standby while accommodating the treatment liquid; a feeding mechanism that feeds the treatment liquid to the treating device from the feeding tank in the feeding mode among the plurality of feeding tanks; a recovery mechanism that recovers and returns the treatment liquid excessive in the treatment device to the feeding tank in the feeding mode; and an on-off mechanism provided in each of the plurality of feeding tanks to block the exhaust passage and the overflow line is provided.Type: ApplicationFiled: November 12, 2015Publication date: March 3, 2016Applicant: SHIBAURA MECHATRONICS CORPORATIONInventors: Konosuke HAYASHI, Takashi OOTAGAKI, Emi MATSUI
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Publication number: 20140182761Abstract: According to one embodiment, a bonding apparatus for processing a retained substrate includes a main body unit, a nozzle, a gas supply unit, and a substrate support unit. The nozzle opens on a face of the main body unit on a side that a first substrate is retained. The gas supply unit is configured to supply gas to the nozzle, to apply suction to the first substrate and to separate the substrate from the face of the main body unit. The substrate support unit is configured to support a peripheral edge portion of a second substrate provided in opposition to the first substrate with a predetermined gap.Type: ApplicationFiled: December 23, 2013Publication date: July 3, 2014Inventors: Konosuke Hayashi, Emi Matsui