Patents by Inventor Emi Soshino

Emi Soshino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of installing circuit member in resin-molded panel
    Patent number: 7201867
    Abstract: A method includes a first, a second and a third step, and a circuit member is installed in a resin-molded panel simultaneously when this resin-molded panel is vacuum formed. In the first step, the circuit member to be installed is placed on an upper surface of a circuit member-installing portion formed on and projecting from a front surface of a base mold. In the second step, a heated and softened panel material is laid on the front surface of the base mold. In the third step, the air between the panel material and the base mold is drawn via notch spaces and air-drawing holes.
    Type: Grant
    Filed: April 18, 2003
    Date of Patent: April 10, 2007
    Assignee: Yazaki Corporation
    Inventors: Naomi Kisu, Emi Soshino
  • Method of installing circuit member in resin-molded panel and vacuum forming mold
    Publication number: 20030218279
    Abstract: A method includes a first, a second and a third step, and a circuit member is installed in a resin-molded panel simultaneously when this resin-molded panel is vacuum formed. In the first step, the circuit member to be installed is placed on an upper surface of a circuit member-installing portion formed on and projecting from a front surface of a base mold. In the second step, a heated and softened panel material is laid on the front surface of the base mold. In the third step, the air between the panel material and the base mold is drawn via notch spaces and air-drawing holes.
    Type: Application
    Filed: April 18, 2003
    Publication date: November 27, 2003
    Applicant: YAZAKI CORPORATION
    Inventors: Naomi Kisu, Emi Soshino