Abstract: A workpiece processing method including bringing a boron-containing substance removal liquid containing orthoperiodic acid and water into contact with a workpiece containing a boron-containing substance to remove the boron-containing substance. The removal liquid contains orthoperiodic acid and water and is used for removing a boron-containing substance from a workpiece containing the boron-containing substance.

Abstract: A cleaning solution, a method for cleaning a substrate, and a method for manufacturing a semiconductor. The cleaning solution includes at least one of a compound a1 represented by a general formula (a1), a salt of the compound (a1), a hydrate of the compound (a1), hydrogen iodide, borane, and a complex of the borane; an amine compound that has 4 or more carbon atoms and is not the compound a1, or a salt thereof; and an anticorrosive agent, in which R1 and R2 each independently represents an organic group that does not contain a carbonyl group, or a hydrogen atom.

Abstract: A cleaning liquid for removing an etching residue containing a titanium component, the cleaning liquid including a compound represented by General Formula (a1) below, in which the cleaning liquid has a pH of 6 or greater, which is measured at 23° C.

Abstract: A cleaning liquid that removes an etching residue containing a titanium component, the cleaning liquid including a compound represented by General Formula (a1) and a compound (B) represented by General Formula (b1). In formula (a1), Ra0 represents a monovalent organic group containing a hydroxy group or a carboxy group, or a hydrogen atom.

Abstract: A surface treatment agent containing a silylating agent (A) and a compound (C) having an amide skeleton in a molecule, and a surface treatment method for subjecting an object to be treated to surface treatment using the surface treatment agent.

Abstract: A resist composition containing a polymer compound which has a constitutional unit (a0) represented by Formula (a0-1); and an acid generator which is formed of a compound represented by Formula (b1) (in the formulae, Ra00 represents an acid dissociable group represented by Formula (a0-r1-1); Ra01, Ra02, Ra031, Ra032, and Ra033 represent a hydrocarbon group; Ya0 represents a quaternary carbon atom; Rb1 represents a hydrocarbon group which has a steroid skeleton containing at least one hydroxyl group; Yb1 represents a divalent linking group having a single bond or a hetero atom; Vb1 represents a single bond, an alkylene group, or a fluorinated alkylene group; and Rf1 represents a hydrogen atom, a fluorine atom, or a fluorinated alkyl group).

Abstract: A surface treatment agent containing a silylating agent (A) and a compound (C) having an amide skeleton in a molecule, and a surface treatment method for subjecting an object to be treated to surface treatment using the surface treatment agent.

Abstract: A surface treatment agent including: a silylating agent and a solvent, the solvent containing an aliphatic hydrocarbon.

Abstract: A resist composition containing a polymer compound which has a constitutional unit (a0) represented by Formula (a0-1); and an acid generator which is formed of a compound represented by Formula (b1) (in the formulae, Re represents an acid dissociable group represented by Formula (a0-r1-1); Ra01, Ra02, Ra031, Ra032, and Ra033 represent a hydrocarbon group; Ya° represents a quaternary carbon atom; Rb1 represents a hydrocarbon group which has a steroid skeleton containing at least one hydroxyl group; Y represents a divalent linking group having a single bond or a hetero atom; Vb1 represents a single bond, an alkylene group, or a fluorinated alkylene group; and Rf1 represents a hydrogen atom, a fluorine atom, or a fluorinated alkyl group).