Abstract: A handler is disclosed. The handler can include a robotic arm. The robotic arm can be coupled to a driver. The handler can include a nozzle. The nozzle can be coupled to the robotic arm. The nozzle can include a carbon fiber reinforced polymer and be configured to pick-and-place an electronic component to a carrier. The handler can include a robotic arm filter that is coupled between the robotic arm and a frame of the handler. The nozzle is configured to pick-and-place an electronic component to a carrier. The handler can include a plurality of filters. The plurality of filters can include a robotic arm filter, a driver filter, a chassis ground filter, and/or a packaged filter. The robotic arm filter can be coupled between the robotic arm and a frame of the handler. The driver filter can be coupled between the driver and the frame. The chassis ground filter can be coupled between the driver and earth ground. The packaged filter can be positioned between the nozzle and the earth ground.