Patents by Inventor Emil Anton Kneer

Emil Anton Kneer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for removing contaminant from a surface and composition useful therefor description
    Patent number: 7700534
    Abstract: Particulate and metal ion contamination is removed from a surface, such as a semiconductor wafer containing copper damascene or dual damascene features, employing a fluo-ride-free aqueous composition comprising a dicarboxylic acid and/or salt thereof; and a hydroxycarboxylic acid and/or salt thereof or amine group containing acid.
    Type: Grant
    Filed: March 21, 2008
    Date of Patent: April 20, 2010
    Assignee: Air Products and Chemicals, Inc.
    Inventor: Emil Anton Kneer
  • Process for removing contaminant from a surface and composition useful therefor
    Patent number: 7524801
    Abstract: Particulate and metal ion contamination is removed from a surface, such as a semiconductor wafer containing copper damascene or dual damascene features, employing a fluoride-free aqueous composition comprising a dicarboxylic acid and/or salt thereof; and a hydroxycarboxylic acid and/or salt thereof or amine group containing acid.
    Type: Grant
    Filed: September 2, 2003
    Date of Patent: April 28, 2009
    Assignee: Air Products and Chemicals, Inc.
    Inventor: Emil Anton Kneer
  • Process for Removing Contaminant from a Surface and Composition Useful Therefor Description
    Publication number: 20080167209
    Abstract: Particulate and metal ion contamination is removed from a surface, such as a semiconductor wafer containing copper damascene or dual damascene features, employing a fluo-ride-free aqueous composition comprising a dicarboxylic acid and/or salt thereof; and a hydroxycarboxylic acid and/or salt thereof or amine group containing acid.
    Type: Application
    Filed: March 21, 2008
    Publication date: July 10, 2008
    Applicant: AIR PRODUCTS AND CHEMICALS, INC.
    Inventor: Emil Anton Kneer
  • Process for removing contaminant from a surface and composition useful therefor
    Publication number: 20040035354
    Abstract: Particulate and metal ion contamination is removed from a surface, such as a semiconductor wafer containing copper damascene or dual damascene features, employing a fluoride-free aqueous composition comprising a dicarboxylic acid and/or salt thereof; and a hydroxycarboxylic acid and/or salt thereof or amine group containing acid.
    Type: Application
    Filed: September 2, 2003
    Publication date: February 26, 2004
    Applicant: Ashland Inc.
    Inventor: Emil Anton Kneer
  • Process for removing contaminant from a surface and composition useful therefor
    Patent number: 6673757
    Abstract: Particulate and metal ion contamination is removed from a surface, such as a semiconductor wafer containing copper damascene or dual damascene features, employing aqueous composition comprising a fluoride containing compound; a dicarboxylic acid and/or salt thereof; and a hydroxycarboxylic acid and/or salt thereof.
    Type: Grant
    Filed: March 22, 2000
    Date of Patent: January 6, 2004
    Assignee: Ashland Inc.
    Inventor: Emil Anton Kneer
  • Process for removing contaminant from a surface and composition useful therefor
    Patent number: 6627546
    Abstract: Particulate and metal ion contamination is removed from a surface, such as a semiconductor wafer containing copper damascene or dual damascene features, employing a fluoride-free aqueous composition comprising a dicarboxylic acid and/or salt thereof; and a hydroxycarboxylic acid and/or salt thereof or amine group containing acid.
    Type: Grant
    Filed: June 29, 2001
    Date of Patent: September 30, 2003
    Assignee: Ashland Inc.
    Inventor: Emil Anton Kneer
  • Process for removing contaminant from a surface and composition useful therefor
    Publication number: 20030096500
    Abstract: Particulate and metal ion contamination is removed from a surface, such as a semiconductor wafer containing copper damascene or dual damascene features, employing a fluoride-free aqueous composition comprising a dicarboxylic acid and/or salt thereof; and a hydroxycarboxylic acid and/or salt thereof or amine group containing acid.
    Type: Application
    Filed: June 29, 2001
    Publication date: May 22, 2003
    Inventor: Emil Anton Kneer
  • Process for removing contaminant from a surface and composition useful therefor
    Patent number: 6147002
    Abstract: Particulate and metal ion contamination is removed from a surface, such as a semiconductor wafer containing copper damascene or dual damascene features, employing aqueous composition comprising a fluoride containing compound; a dicarboxylic acid and/or salt thereof; and a hydroxycarboxylic acid and/or salt thereof.
    Type: Grant
    Filed: May 26, 1999
    Date of Patent: November 14, 2000
    Assignee: Ashland Inc.
    Inventor: Emil Anton Kneer