Abstract: An electrical component assembly (301) comprising a heat sink (310), electrical components (321-1, 321-2, 322, 323) arranged on the heat sink (310) and an interconnect (330a) electrically connecting the electrical components (321-1, 321-2, 322, 323). The heat sink (310) is integrated with the electrical interconnect (330a) such that the electrical interconnect (330a) is at least partly arranged in and extends along a cavity (311a, 311b) of the heat sink (310). The electrical interconnect (330a) comprises at least one layer (332, 334) of deposited material comprising electrically conductive material forming one or more interconnecting conductors (338, 339). The interconnect further comprises one or more dielectric layers (331, 333, 335) of deposited material which isolate the one or more interconnecting conductors (338, 339). The one or more interconnecting conductors (338, 339) electrically contacts the respective electrical component in a respective contact area (311-c) of the cavity (311a, 311b).

Abstract: There is disclosed an electronic device comprising a printed circuit board, PCB, the PCB having one or more thermal vias filled with thermally conductive material. The electronic device further having a package, the package including a substrate and a die, the die having an active side with integrated circuity, and a heat-removal side. The heat-removal side of the die is in thermally conductive connection with the one or more thermal vias via solder balls. The disclosure also pertains to related devices and methods.

Abstract: The present invention relates to a carrier substrate comprising thermal vias for thermally interconnecting components arranged on at least a first side of the carrier substrate to a heat pipe, wherein the carrier substrate further comprises a first substrate with thermal vias configured to be connected to a first component; a second substrate comprising a groove with a heat pipe; and wherein the first substrate is adhered to the second substrate by an adhesive, such that the heat pipe is embedded in said groove between the first substrate and the second substrate. The present invention also relates to an electronic assembly comprising such a carrier substrate.

Abstract: The present invention relates to a method (100) of producing a printed circuit board (300), wherein the printed circuit board (300) comprises a first substrate (301), a second substrate (302), and a heat pipe tube (303) with an open end (304). The method comprises the step of forming (S100) a recess (305) in the first substrate (301), placing (S120) the heat pipe tube (303) in the recess (305) of the first substrate (301) such that the open end (304) is exposed, and laminating (S130) the first substrate (301) and the second substrate (302) with the heat pipe tube (304) embedded in the recess (305) between the first substrate (301) and the second substrate (302). The present invention also relates to a printed circuit board, a circuit board as well as a method for producing a circuit board.

Abstract: An electrical component assembly (301) comprising a heat sink (310), electrical components (321-1, 321-2, 322, 323) arranged on the heat sink (310) and an interconnect (330a) electrically connecting the electrical components (321-1, 321-2, 322, 323). The heat sink (310) is integrated with the electrical interconnect (330a) such that the electrical interconnect (330a) is at least partly arranged in and extends along a cavity (311a, 311b) of the heat sink (310). The electrical interconnect (330a) comprises at least one layer (332, 334) of deposited material comprising electrically conductive material forming one or more interconnecting conductors (338, 339). The interconnect further comprises one or more dielectric layers (331, 333, 335) of deposited material which isolate the one or more interconnecting conductors (338, 339). The one or more interconnecting conductors (338, 339) electrically contacts the respective electrical component in a respective contact area (311-c) of the cavity (311a, 311b).