Abstract: The present invention relates to methods for embedded a micrometer and/or nanometer pattern into an injection molding tool. In a first main aspect, a micro/nanometer structured imprinting device is applied in, or on, an active surface so as to transfer the micro/nanometer patterned structure to the tool while the imprinting device is, at least partly, within a cavity of the injection molding tool. In a second main aspect, a base plate with a micro/nanometer structured pattern positioned on an upper part is positioned on the active surface within the tool, the lower part of the base plate facing the tool, the active surface receiving the base plate being non-planar on a macroscopic scale. Both aspects enable a simple and effective way of transferring the pattern, and the pattern may be transferred on the active working site of tool immediately prior to molding without the need for extensive preparations or remounting of the tool before performing the molding process.

Abstract: The present invention relates to a method for manufacturing a tool part for an injection molding process, a hot embossing process, nano-imprint process or an extrusion process. First, there is provided a master structure (10) with a surface area comprising nanometre-sized protrusions (11) with a minimum density of approximately 105 protrusions/mm2, the protrusions being positioned in a non-periodic, irregular pattern, said protrusions being created by a process comprising alternating passivation and etching into the master structure. Secondly, there is made a transfer of the master structure into a metal insert (20), the metal insert having a corresponding nanometre-sized pattern (21) from said protrusions, and thirdly, adapting the metal insert into a tool part (30) for enabling nanometre-sized patterns being formed by the tool part. The invention provides an easier and faster way of manufacturing the master structure, e.g. a black silicon wafer.