Abstract: A method of assembling a DC-DC converter includes: attaching first and second discrete power stage transistor dies to a first side of a substrate, the first discrete die including a high-side power transistor and the second discrete die including a low-side power transistor electrically connected to the high-side power transistor to form an output phase of the DC-DC converter; attaching an inductor to the first side of the substrate so as to electrically connect the output phase to a metal output trace on the substrate, the inductor partly covering at least one of the first and the second discrete power stage transistor dies such that each discrete power stage transistor die that is partly covered by the inductor comprises a plurality of pins that are not covered by the inductor; and visually inspecting the plurality of pins uncovered by the inductor.

Abstract: A method of assembling a DC-DC converter includes: attaching first and second discrete power stage transistor dies to a first side of a substrate, the first discrete die including a high-side power transistor and the second discrete die including a low-side power transistor electrically connected to the high-side power transistor to form an output phase of the DC-DC converter; attaching an inductor to the first side of the substrate so as to electrically connect the output phase to a metal output trace on the substrate, the inductor partly covering at least one of the first and the second discrete power stage transistor dies such that each discrete power stage transistor die that is partly covered by the inductor comprises a plurality of pins that are not covered by the inductor; and visually inspecting the plurality of pins uncovered by the inductor.

Abstract: A DC-DC converter includes a substrate having opposing first and second sides, a first discrete power stage transistor die attached to the first side of the substrate and including a high-side power transistor, and a second discrete power stage transistor die attached to the first side of the substrate and including a low-side power transistor electrically connected to the high-side power transistor to form an output phase of the DC-DC converter. The DC-DC converter further includes an inductor attached to the first side of the substrate so as to electrically connect the output phase to a metal output trace on the substrate. The inductor at least partly covers at least one of the first and the second discrete power stage transistor dies.

Abstract: A multi-phase DC-DC converter includes a substrate having opposing first and second sides, a plurality of power stage packages attached to the first side of the substrate, each power stage package including active semiconductor components operable to provide an output phase of the multi-phase DC-DC converter, and a coupled inductor attached to the first side of the substrate and at least partly covering two or more of the power stage packages. The coupled inductor includes separate windings wound on the same core. Each winding of the coupled inductor electrically connects an output of one of the power stage packages at least partly covered by the coupled inductor to a metal trace on the substrate such that the outputs of the power stage packages at least partly covered by the coupled inductor are electrically connected to the same metal trace on the substrate.

Abstract: A multi-phase switching voltage regulator includes a controller and a plurality of power stages each configured to deliver output current to a load through an inductor. At least one of the inductors has a higher open circuit inductance than the other inductors so that at least one of the power stages has a different output inductance compared to the other power stages. The controller is configured to control switching of the power stages so as to regulate an output voltage of the multi-phase switching voltage regulator, including allowing all of the power stages to provide current to the load through the respective inductors during a full power event at the load and preventing all of the power stages except for the at least one power stage having the higher open circuit inductance from providing current to the load during a low power event at the load.

Abstract: A DC-DC converter includes a substrate having opposing first and second sides, a power stage attached to the first side of the substrate and having active semiconductor components operable to provide an output phase of the DC-DC converter, an inductor attached to the first side of the substrate and electrically connected to the power stage through a first metal trace at the first side of the substrate, and a plurality of electrically conductive vias extending through the substrate from the first side to the second side. The vias are electrically connected to the first metal trace. At least some of the vias are disposed at least partly under the power stage. A corresponding method of assembling such a DC-DC converter also is disclosed.

Abstract: A DC-DC converter includes a substrate having opposing first and second sides, a power stage attached to the first side of the substrate and having active semiconductor components operable to provide an output phase of the DC-DC converter, an inductor attached to the first side of the substrate and electrically connected to the power stage through a first metal trace at the first side of the substrate, and a plurality of electrically conductive vias extending through the substrate from the first side to the second side. The vias are electrically connected to the first metal trace. At least some of the vias are disposed at least partly under the power stage. A corresponding method of assembling such a DC-DC converter also is disclosed.

Abstract: A DC-DC converter assembly a power stage die of a DC-DC converter attached to a board, an output inductor attached to the board and electrically connected to an output of the power stage die, the output inductor accommodating the power stage die under the output inductor, a plurality of input capacitors attached to the board and electrically connected to input terminals of the power stage die, an output capacitor attached to the board and electrically connected to the output inductor, and a plurality of decoupling capacitors attached to the board and electrically connected to power terminals of the power stage die. A total footprint of the power stage die, the output inductor, the input capacitors, the output capacitor and the decoupling capacitors is at least a third of the combined surface area of the power stage die, the output inductor, the input capacitors, the output capacitor and the decoupling capacitors.

Abstract: A DC-DC converter assembly a power stage die of a DC-DC converter attached to a board, an output inductor attached to the board and electrically connected to an output of the power stage die, the output inductor accommodating the power stage die under the output inductor, a plurality of input capacitors attached to the board and electrically connected to input terminals of the power stage die, an output capacitor attached to the board and electrically connected to the output inductor, and a plurality of decoupling capacitors attached to the board and electrically connected to power terminals of the power stage die. A total footprint of the power stage die, the output inductor, the input capacitors, the output capacitor and the decoupling capacitors is at least a third of the combined surface area of the power stage die, the output inductor, the input capacitors, the output capacitor and the decoupling capacitors.

Abstract: A DC-DC converter assembly includes a board having a first side and a second side opposite the first side, a power stage die of a DC-DC converter attached to the first side of the board, and an output inductor electrically connected to an output of the power stage die and disposed over the power stage die on the first side of the board. The output inductor includes a magnetic core and an electrical conductor having first and second terminals attached to the first side of the board. The output inductor accommodates the power stage die under the magnetic core so that the power stage die is interposed between the magnetic core and the board. A corresponding method of manufacturing the DC-DC converter assembly and method of manufacturing the output inductor are also disclosed.

Abstract: An electrical conductor of a through-hole inductor includes a first section extending along a first side face of the magnetic core, a second section extending along a second side face of the magnetic core, and a third section connecting the first and second sections and extending through the magnetic core. A first straight lead extends downwards from the first section beyond the bottom main face of the magnetic core, and has an unbent distal end configured for through-hole mounting to a circuit board. A second straight lead extends downwards from the second section beyond the bottom main face, and also has an unbent distal end configured for through-hole mounting to the circuit board. The straight leads each have a height which allows for mounting of a power stage to the circuit board at least partly under the magnetic core.

Abstract: An electrical conductor of a surface mount inductor includes a first section extending along a first side face of the magnetic core, a second section extending along a second side face of the magnetic core, and a third section connecting the first and second sections and extending through the magnetic core. A first straight lead extends downwards from the first section beyond the bottom main face of the magnetic core, and has an unbent distal end configured for surface mounting to a circuit board. A second straight lead extends downwards from the second section beyond the bottom main face, and has an unbent distal end configured for surface mounting to the circuit board. The straight leads each have a height and a width which allows for mounting of a power stage to the circuit board at least partly under the magnetic core.

Abstract: A DC-DC converter includes a substrate having opposing first and second sides, a power stage attached to the first side of the substrate and having active semiconductor components operable to provide an output phase of the DC-DC converter, an inductor attached to the first side of the substrate and electrically connected to the power stage through a first metal trace at the first side of the substrate, and a plurality of electrically conductive vias extending through the substrate from the first side to the second side. The vias are electrically connected to the first metal trace. At least some of the vias are disposed at least partly under the power stage. A corresponding method of assembling such a DC-DC converter also is disclosed.

Abstract: A DC-DC converter includes a substrate having opposing first and second sides, a first discrete power stage transistor die attached to the first side of the substrate and including a high-side power transistor, and a second discrete power stage transistor die attached to the first side of the substrate and including a low-side power transistor electrically connected to the high-side power transistor to form an output phase of the DC-DC converter. The DC-DC converter further includes an inductor attached to the first side of the substrate so as to electrically connect the output phase to a metal output trace on the substrate. The inductor at least partly covers at least one of the first and the second discrete power stage transistor dies.

Abstract: A multi-phase DC-DC converter includes a substrate having opposing first and second sides, a plurality of power stage packages attached to the first side of the substrate, each power stage package including active semiconductor components operable to provide an output phase of the multi-phase DC-DC converter, and a coupled inductor attached to the first side of the substrate and at least partly covering two or more of the power stage packages. The coupled inductor includes separate windings wound on the same core. Each winding of the coupled inductor electrically connects an output of one of the power stage packages at least partly covered by the coupled inductor to a metal trace on the substrate such that the outputs of the power stage packages at least partly covered by the coupled inductor are electrically connected to the same metal trace on the substrate.

Abstract: A multi-phase switching voltage regulator includes a controller and a plurality of power stages each configured to deliver output current to a load through an inductor. At least one of the inductors has a higher open circuit inductance than the other inductors so that at least one of the power stages has a different output inductance compared to the other power stages. The controller is configured to control switching of the power stages so as to regulate an output voltage of the multi-phase switching voltage regulator, including allowing all of the power stages to provide current to the load through the respective inductors during a full power event at the load and preventing all of the power stages except for the at least one power stage having the higher open circuit inductance from providing current to the load during a low power event at the load.

Abstract: A DC-DC converter assembly includes a board having a first side and a second side opposite the first side, a power stage die of a DC-DC converter attached to the first side of the board, and an output inductor electrically connected to an output of the power stage die and disposed over the power stage die on the first side of the board. The output inductor includes a magnetic core and an electrical conductor having first and second terminals attached to the first side of the board. The output inductor accommodates the power stage die under the magnetic core so that the power stage die is interposed between the magnetic core and the board. A corresponding method of manufacturing the DC-DC converter assembly and method of manufacturing the output inductor are also disclosed.