Abstract: Various deficiencies in the prior art are addressed by systems, methods, architectures, mechanisms and/or apparatus configured for fabricating a strain sensing device directly on a structure by printing or otherwise depositing a material on the structure, the material exhibiting a piezo-resistive effect, and sintering a strain sensing pattern from the material such that the strain sensing pattern becomes electrically conductive.

Abstract: A method for making an antenna comprises creating a digital antenna file defining dimensional characteristics of a radiating support structure and a ground support structure; uploading the digital antenna file to an additive-manufacturing device; manufacturing the radiating support structure and ground support structure with the additive-manufacturing device; coating one side of the radiating support structure and ground support structure with a conductive ink; attaching the radiating support structure and ground support structure together; fixing a radio frequency connector to the conductive ink on the radiating support structure and the ground support structure. The radiating support structure and the ground support structure are attached together with a dielectric adhesive.

Abstract: A printed circuit board (PCB) comprises two or more PCB layers comprising of a dielectric core and conductive cladding on adjoining surfaces; one or more DC lines embedded in one or more layers of the two or more PCB layers; one or more RF signal lines embedded in one or more layers of the two or more PCB layers; wherein the one or more DC lines crosses over/under at least one of the RF signal lines to form at least one crossover, wherein the at least one crossover is no thicker than the PCB layer in which it is situated. The printed circuit board of claim 1, further comprising two or more generally parallel DC lines which converge to form a stack of superposed parallel DC lines where the two or more DC lines cross over the one or more RF signal lines.

Abstract: Various deficiencies in the prior art are addressed by systems, methods, architectures, mechanisms and/or apparatus configured for fabricating a strain sensing device directly on a structure by printing a material on the structure, the material exhibiting a piezo-resistive effect, and sintering a strain sensing pattern from the material such that the strain sensing pattern becomes electrically conductive.