Patents by Inventor Emmanuel Chua Abas
Emmanuel Chua Abas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11280019Abstract: One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.Type: GrantFiled: June 19, 2019Date of Patent: March 22, 2022Assignee: SunPower CorporationInventors: Emmanuel Chua Abas, Chen-An Chen, Diana Xiaobing Ma, Kalyana Bhargava Ganti, Edmundo Anida Divino, Jake Randal G. Ermita, Jose Francisco S. Capulong, Arnold Villamor Castillo
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Patent number: 10720351Abstract: This specification describes methods for processing semiconductor wafers, methods for loading semiconductor wafers into wafer carriers, and semiconductor wafer carriers. The methods and wafer carriers can be used for increasing the rigidity of wafers, e.g., large and thin wafers, by intentionally bowing the wafers to an extent that does not break the wafers. In some examples, a method for processing semiconductor wafers includes loading each semiconductor wafer into a respective semiconductor wafer slot of a semiconductor wafer carrier, horizontally bowing each semiconductor wafer, and moving the semiconductor wafer carrier into a processing station and processing the semiconductor wafers at the processing station while the semiconductor wafers are loaded into the semiconductor wafer carrier and horizontally bowed.Type: GrantFiled: August 31, 2018Date of Patent: July 21, 2020Assignee: SunPower CorporationInventor: Emmanuel Chua Abas
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Patent number: 10566230Abstract: A wafer transfer system can include a wafer gripper for picking and placing semiconductor devices. In an embodiment, the wafer gripper can include a first portion, a second portion and a laminate between the first and second portion. In one embodiment, the first portion can comprise glass or tempered glass, where the first portion having at least one vacuum hole and is configured to receive the semiconductor device. In an embodiment, the second portion can include glass or tempered glass, the second portion having configured to use low air pressure from a closed vacuum to vacuum a wafer. In an embodiment, the laminate can bond the first portion to the second portion.Type: GrantFiled: April 1, 2016Date of Patent: February 18, 2020Assignee: SunPower CorporationInventors: Emmanuel Chua Abas, Vergil Rodriguez Sandoval
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Patent number: 10553466Abstract: This specification describes semiconductor wafer carriers, methods for manufacturing the semiconductor wafer carriers, and methods for using the semiconductor wafer carriers. The semiconductor wafer carriers can include features for avoiding double-slotting, for preventing glove marks on semiconductor wafers, and for providing additional sitting and storage options for the wafer carrier. In some examples, a semiconductor wafer carrier includes multiple notched left-side rods that are parallel in a vertical direction and multiple notched right-side rods that are parallel in the vertical direction. The semiconductor wafer carrier includes one or more bottom rods. The left-side rods, the right-side rods, and the one or more bottom rods are joined to define semiconductor wafer slots.Type: GrantFiled: July 9, 2018Date of Patent: February 4, 2020Assignee: SUNPOWER CORPORATIONInventors: Emmanuel Chua Abas, Carl Anthony Pangan Pondoyo, Emil Alcaraz Pares, Arnold Villamor Castillo, Vergil Rodriguez Sandoval
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Publication number: 20190301046Abstract: One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.Type: ApplicationFiled: June 19, 2019Publication date: October 3, 2019Applicant: SunPower CorporationInventors: Emmanuel Chua ABAS, Chen-An CHEN, Diana Xiaobing MA, Kalyana Bhargava GANTI, Edmundo Anida DIVINO, Jake Randal G. ERMITA, Jose Francisco S. CAPULONG, Arnold Villamor CASTILLO
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Publication number: 20180374730Abstract: This specification describes methods for processing semiconductor wafers, methods for loading semiconductor wafers into wafer carriers, and semiconductor wafer carriers. The methods and wafer carriers can be used for increasing the rigidity of wafers, e.g., large and thin wafers, by intentionally bowing the wafers to an extent that does not break the wafers. In some examples, a method for processing semiconductor wafers includes loading each semiconductor wafer into a respective semiconductor wafer slot of a semiconductor wafer carrier, horizontally bowing each semiconductor wafer, and moving the semiconductor wafer carrier into a processing station and processing the semiconductor wafers at the processing station while the semiconductor wafers are loaded into the semiconductor wafer carrier and horizontally bowed.Type: ApplicationFiled: August 31, 2018Publication date: December 27, 2018Inventor: Emmanuel Chua Abas
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Publication number: 20180337080Abstract: This specification describes semiconductor wafer carriers, methods for manufacturing the semiconductor wafer carriers, and methods for using the semiconductor wafer carriers. The semiconductor wafer carriers can include features for avoiding double-slotting, for preventing glove marks on semiconductor wafers, and for providing additional sitting and storage options for the wafer carrier. In some examples, a semiconductor wafer carrier includes multiple notched left-side rods that are parallel in a vertical direction and multiple notched right-side rods that are parallel in the vertical direction. The semiconductor wafer carrier includes one or more bottom rods. The left-side rods, the right-side rods, and the one or more bottom rods are joined to define semiconductor wafer slots.Type: ApplicationFiled: July 9, 2018Publication date: November 22, 2018Inventors: Emmanuel Chua Abas, Carl Anthony Pangan Pondoyo, Emil Alcaraz Pares, Arnold Villamor Castillo, Vergil Rodriguez Sandoval
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Patent number: 10068787Abstract: Methods for processing semiconductor wafers, methods for loading semiconductor wafers into wafer carriers, and semiconductor wafer carriers. The methods and wafer carriers can be used for increasing the rigidity of wafers, e.g., large and thin wafers, by intentionally bowing the wafers to an extent that does not break the wafers. In some examples, a method for processing semiconductor wafers includes loading each semiconductor wafer into a respective semiconductor wafer slot of a semiconductor wafer carrier, horizontally bowing each semiconductor wafer, and moving the semiconductor wafer carrier into a processing station and processing the semiconductor wafers at the processing station while the semiconductor wafers are loaded into the semiconductor wafer carrier and horizontally bowed.Type: GrantFiled: December 30, 2016Date of Patent: September 4, 2018Assignee: SUNPOWER CORPORATIONInventor: Emmanuel Chua Abas
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Patent number: 10020213Abstract: Semiconductor wafer carriers, methods for manufacturing the semiconductor wafer carriers, and methods for using the semiconductor wafer carriers. The semiconductor wafer carriers can include features for avoiding double-slotting, for preventing glove marks on semiconductor wafers, and for providing additional sitting and storage options for the wafer carrier. In some examples, a semiconductor wafer carrier includes multiple notched left-side rods that are parallel in a vertical direction and multiple notched right-side rods that are parallel in the vertical direction. The semiconductor wafer carrier includes one or more bottom rods. The left-side rods, the right-side rods, and the one or more bottom rods are joined to define semiconductor wafer slots.Type: GrantFiled: December 30, 2016Date of Patent: July 10, 2018Assignee: SUNPOWER CORPORATIONInventors: Emmanuel Chua Abas, Carl Anthony Pangan Pondoyo, Emil Alcaraz Pares, Arnold Villamor Castillo, Vergil Rodriguez Sandoval
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Publication number: 20180190525Abstract: Methods for processing semiconductor wafers, methods for loading semiconductor wafers into wafer carriers, and semiconductor wafer carriers. The methods and wafer carriers can be used for increasing the rigidity of wafers, e.g., large and thin wafers, by intentionally bowing the wafers to an extent that does not break the wafers. In some examples, a method for processing semiconductor wafers includes loading each semiconductor wafer into a respective semiconductor wafer slot of a semiconductor wafer carrier, horizontally bowing each semiconductor wafer, and moving the semiconductor wafer carrier into a processing station and processing the semiconductor wafers at the processing station while the semiconductor wafers are loaded into the semiconductor wafer carrier and horizontally bowed.Type: ApplicationFiled: December 30, 2016Publication date: July 5, 2018Inventor: Emmanuel Chua Abas
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Publication number: 20180190524Abstract: Semiconductor wafer carriers, methods for manufacturing the semiconductor wafer carriers, and methods for using the semiconductor wafer carriers. The semiconductor wafer carriers can include features for avoiding double-slotting, for preventing glove marks on semiconductor wafers, and for providing additional sitting and storage options for the wafer carrier. In some examples, a semiconductor wafer carrier includes multiple notched left-side rods that are parallel in a vertical direction and multiple notched right-side rods that are parallel in the vertical direction. The semiconductor wafer carrier includes one or more bottom rods. The left-side rods, the right-side rods, and the one or more bottom rods are joined to define semiconductor wafer slots.Type: ApplicationFiled: December 30, 2016Publication date: July 5, 2018Inventors: Emmanuel Chua Abas, Carl Anthony Pangan Pondoyo, Emil Alcaraz Pares, Arnold Villamor Castillo, Vergil Rodriguez Sandoval
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Publication number: 20170287766Abstract: A wafer transfer system can include a wafer gripper for picking and placing semiconductor devices. In an embodiment, the wafer gripper can include a first portion, a second portion and a laminate between the first and second portion. In one embodiment, the first portion can comprise glass or tempered glass, where the first portion having at least one vacuum hole and is configured to receive the semiconductor device. In an embodiment, the second portion can include glass or tempered glass, the second portion having configured to use low air pressure from a closed vacuum to vacuum a wafer. In an embodiment, the laminate can bond the first portion to the second portion.Type: ApplicationFiled: April 1, 2016Publication date: October 5, 2017Inventors: Emmanuel Chua Abas, Vergil Rodriguez Sandoval
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Publication number: 20160108541Abstract: One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.Type: ApplicationFiled: December 2, 2015Publication date: April 21, 2016Applicant: SunPower CorporationInventors: Emmanuel Chua ABAS, Chen-An CHEN, Diana Xiaobing MA, Kalyana Bhargava GANTI, Edmundo Anida DIVINO, Jake Randal G. ERMITA, Jose Francisco S. CAPULONG, Arnold Villamor CASTILLO
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Patent number: 9222193Abstract: One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.Type: GrantFiled: October 26, 2012Date of Patent: December 29, 2015Assignee: SunPower CorporationInventors: Emmanuel Chua Abas, Chen-An Chen, Diana Xiaobing Ma, Kalyana Bhargava Ganti, Edmundo Anida Divino, Jake Randal G. Ermita, Jose Francisco S. Capulong, Arnold Villamor Castillo
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Patent number: 8317987Abstract: One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.Type: GrantFiled: September 23, 2010Date of Patent: November 27, 2012Assignee: SunPower CorporationInventors: Emmanuel Chua Abas, Chen-An Chen, Diana Xiaobing Ma, Kalyana Bhargava Ganti
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Patent number: 8221601Abstract: One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The carrier includes a non-conductive carrier body on which the substrates are placed and conductive lines embedded within the carrier body. A plurality of conductive clip attachment parts are attached in a permanent manner to the conductive lines embedded within the carrier body. A plurality of contact clips are attached in a removable manner to the clip attachment parts. The contact clips hold the substrates in place and conductively connecting the substrates with the conductive lines. Other embodiments, aspects and features are also disclosed.Type: GrantFiled: September 23, 2010Date of Patent: July 17, 2012Assignee: SunPower CorporationInventors: Chen-An Chen, Emmanuel Chua Abas, Edmundo Anida Divino, Jake Randal G. Ermita, Jose Francisco S. Capulong, Arnold Villamor Castillo, Diana Xiaobing Ma
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Publication number: 20120073974Abstract: One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.Type: ApplicationFiled: September 23, 2010Publication date: March 29, 2012Inventors: Emmanuel Chua ABAS, Chen-An CHEN, Diana Xiaobing MA, Kalyana Bhargava GANTI
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Publication number: 20120073976Abstract: One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The carrier includes a non-conductive carrier body on which the substrates are placed and conductive lines embedded within the carrier body. A plurality of conductive clip attachment parts are attached in a permanent manner to the conductive lines embedded within the carrier body. A plurality of contact clips are attached in a removable manner to the clip attachment parts. The contact clips hold the substrates in place and conductively connecting the substrates with the conductive lines. Other embodiments, aspects and features are also disclosed.Type: ApplicationFiled: September 23, 2010Publication date: March 29, 2012Inventors: Chen-An CHEN, Emmanuel Chua ABAS, Edmundo Anida DIVINO, Jake Randal G. ERMITA, Jose Francisco S. CAPULONG, Arnold Villamor CASTILLO, Diana Xiaobing MA
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Patent number: RE46088Abstract: One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The carrier includes a non-conductive carrier body on which the substrates are placed and conductive lines embedded within the carrier body. A plurality of conductive clip attachment parts are attached in a permanent manner to the conductive lines embedded within the carrier body. A plurality of contact clips are attached in a removable manner to the clip attachment parts. The contact clips hold the substrates in place and conductively connecting the substrates with the conductive lines. Other embodiments, aspects and features are also disclosed.Type: GrantFiled: May 5, 2015Date of Patent: August 2, 2016Assignee: SunPower CorporationInventors: Chen-An Chen, Emmanuel Chua Abas, Edmundo Anida Divino, Jake Randal G. Ermita, Jose Francisco S. Capulong, Arnold Villamor Castillo, Diana Xiaobing Ma